[1 ] S.A. Nightingale and D.P. Dunne: J. Mater. Sci., 1996, 31, 5039.
[2 ] K.H. Brosnan, G.L. Messing and D.K. Agrawal: J. Am. Ceram. Soc., 2003, 86(8), 1307.
[3 ] R.R. Menezes and R.H.G.A. Kiminami: J. Mater. Process. Technol., 2008, 203, 513.
[4 ] M.I. Jones, M.C. Valecillos, K. Hirao and M. Toriyama: J. Am. Ceram. Soc., 2001, 84(10), 2424.
[5 ] H. Fukushima: J. Ceram. Soc. Jpn., 1995, 103, 1011.
[6 ] K.S. Park, J.T. Son, H.T. Chung, S.J. Kim, C.H. Lee and H.G. Kim: Electrochem. Commun., 2003, 5, 839.
[7 ] T. Ebadzadeh and M. Valefi: J. Alloy. Compd., 2008, 448, 246.
[8 ] Z.J. Huang, M. Gotoh and Y. Hirose: J. Mater. Process. Technol., 2009, 209, 2446.
[9 ] R.R. Menezes, P.M. Souto and R.H.G.A. Kiminami: J. Mater. Process. Technol., 2007, 190, 223.
[10] J. Wang, J. Binner, B. Vaidhyanathan, N. Joomun, J. Kilner, G. Dimitrakis and T.E. Cross: J. Am. Ceram. Soc., 2006, 89(6), 1977.
[11] S.G. Wang, A.M. Chang, H.M. Zhang and Q. Zhao: Mater. Chem. Phys., 2007, 110, 87.
[12] K.H. Brosnan, G.L. Messing and D.K. Agrawal: J. Am. Ceram. Soc., 2003, 86(8), 1312.
[13] F. Selmi, F. Guerin, X.D. Yu, V.K. Varadan, V.V. Varadan and S. Komarneni: Mater. Lett., 1992, 12, 425.
[14] K. Park, J.K. Lee, J.G. Kim and S. Nahm: J. Alloy. Compd., 2007, 437, 212.
[15] S.A. Kanade and V. Puri: Mater. Res. Bull., 2008, 43, 822.
[16] S.B. SU, S.G. Song, Y.Z. Zheng and B.D.L. Ai: Mater. Sci. Eng., 2002, 20(3), 387.