J. Mater. Sci. Technol. ›› 2020, Vol. 54: 87-94.DOI: 10.1016/j.jmst.2020.03.043
• Research Article • Previous Articles Next Articles
Xu-Ping Wua,b, Xue-Mei Luoa,*(), Hong-Lei Chena,b, Ji-Peng Zoua,b, Guang-Ping Zhanga,*()
Received:
2020-01-22
Revised:
2020-02-25
Accepted:
2020-03-02
Published:
2020-10-01
Online:
2020-10-21
Contact:
Xue-Mei Luo,Guang-Ping Zhang
Xu-Ping Wu, Xue-Mei Luo, Hong-Lei Chen, Ji-Peng Zou, Guang-Ping Zhang. A unified model for determining fracture strain of metal films on flexible substrates[J]. J. Mater. Sci. Technol., 2020, 54: 87-94.
Fig. 3. Electrical resistance-strain curves of (a) Cu-5 at.% Al films with h = 10 nm, 200 nm and 1000 nm and (b) Ti films with h = 50 nm, 100 nm and 300 nm. The theoretical curves obtained by M model (Eq. (6)) and Eq. (1) are plotted as red dotted line and black dotted line, respectively.
Fig. 4. Electrical resistance-strain curves of (a) Cu films of Niu et al. [7] and (b) Ag films of Sim et al. [13]. The theoretical curves obtained by M model (Eq. (6)) and Eq. (1) are plotted as red dotted line and black dotted line, respectively. Inset of (a) presents the fracture strain determined by M model and linear fitting.
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