J. Mater. Sci. Technol. ›› 2020, Vol. 44: 201-208.DOI: 10.1016/j.jmst.2019.10.038

• Research Article • Previous Articles     Next Articles

Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys

Xiaojun Sunab, Jie Heab*(), Bin Chenab, Lili Zhanga, Hongxiang Jianga, Jiuzhou Zhaoab, Hongri Haoa   

  1. a Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
    b School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China
  • Received:2019-09-19 Revised:2019-10-09 Accepted:2019-10-12 Published:2020-05-01 Online:2020-05-21
  • Contact: Jie He

Abstract:

The immiscible Cu-Fe alloy was characterized by a metastable miscibility gap. With the addition element Zr, the miscibility gap can be extended into the Cu-Fe-Zr ternary system. The effect of the atomic ratio of Cu to Fe and Zr content on the behavior of liquid-liquid phase separation was studied. The results show that liquid-liquid phase separation into Cu-rich and Fe-rich liquids took place in the as-quenched Cu-Fe-Zr alloy. A glassy structure with nanoscale phase separation was obtained in the as-quenched (Cu0.5Fe0.5)40Zr60 alloy sample, exhibiting a homogeneous distribution of glassy Cu-rich nanoparticles in glassy Fe-rich matrix. The microstructural evolution and the competitive mechanism of phase formation in the rapidly solidified Cu-Fe-Zr system were discussed in detail. Moreover, the electrical property of the as-quenched Cu-Fe-Zr alloy samples was examined. It displays an abnormal change of electrical resistivity upon temperature in the nanoscale-phase-separation metallic glass. The crystallization behavior of such metallic glass has been discussed.

Key words: Immiscible alloys, Liquid-liquid phase separation, Rapid solidification, Microstructure, Electrical resistivity behavior