Fig. 1. Experimental setup for electrodeposition of Cu on CF samples.

Fig. 2. (a) As-received CF sample, (b) Au-sputtered CF sample, and (c) surface morphologies of the CF samples.

Fig. 3. (a) EDS spectrum and (b) elemental mapping of Au-sputtered CF wires.

Fig. 4. (a) Stress-strain curves and (b) mechanical and (c) electrical properties of the as-received CF and CF/Au composite wires.

Fig. 5. Deposition of Cu on the as-received CFs at regions with (a) low nuclei population density and (b) high nuclei population density after 9 s.

Fig. 6. Electrodeposition of Cu on Au-sputtered CF samples in 9 s. (a) nucleation region and (b) coalescence region.

Fig. 7. (a) Optical image and (b) SEM image of the CF/Au/Cu composite wires at 10 min deposition of Cu, (c) Cross-section of the CF/Au/Cu composite wires after Cu deposition at 1 min, and (d) Diameter and CF volume fraction of the CF/Au/Cu composite wires at different electrodeposition time.

Fig. 8. Resistance and electrical conductivity of the CF/Au/Cu composite wires at different electrodeposition time.

Fig. 9. (a) Stress-strain curves and (b) mechanical properties of the CF/Au/Cu composite wires at different electrodeposition time.

Fig. 10. Fracture morphologies of the CF/Au/Cu composite wires deposited with Cu at 10 min. (a) upper broken part and (b) lower broken part.

Fig. 11. (a) Comparison of the tensile strength and electrical conductivity of the CF/Au/Cu composite wires in this work with several metals [33] and the graphene/Cu and CNT/Cu composite wires without any post-treatments [14,[16], [17], [18]], (b) An LED lamp lit by two CF/Au/Cu composite wires.