Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils

doi:10.1016/j.jmst.2020.10.019

Abstract

Abstract:

Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries. Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils. Here we chose Bis-(3-sulfopropyl)-disulfide (SPS) as the additive and investigated its concentration on the surface roughness and tensile strength of the electrodeposited copper foils. A copper foil with the smoothest surface (Rz = 2.1 μm) and the highest tensile strength (~338 MPa) was prepared with 1.5 mg/L SPS. The contact angle on the copper foil decreased with the reduction of surface roughness. The enhancing mechanism of the SPS was investigated by scanning electron microscopy and X-ray diffraction. The refined grain and enhanced (220) texture were considered to be the radical reason for the smooth and strong copper foils. The electrochemical results prove the suppressing effect is related to the SPS adsorption.

Key words: Electrodeposited copper foil, Bis-(3-sulfopropyl)-disulfide, Surface roughness, Tensile strength

Lingling Liu, Yeqiang Bu, Yue Sun, Jianfeng Pan, Jiabin Liu, Jien Ma, Lin Qiu, Youtong Fang. Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils[J]. J. Mater. Sci. Technol., 2021, 74: 237-245.

Figures/Tables 12

Fig. 1. Schematic illustration of the electrodeposition device.

Fig. 2. Surface roughness of copper foils with various SPS concentrations.

Fig. 3. (a) Tensile stress-strain curves and (b) mechanical properties of copper foils with various SPS concentrations.

Fig. 4. Contact angles of (a-e) formamide (10.5 % volume fraction) and glycol ether (89.5 % volume fraction) mixed solution droplets and (f-j) water droplets on the prepared copper foils with various SPS concentrations: (a, f) 0?mg/L, (b, g) 0.5?mg/L, (c, h) 1.5?mg/L, (d, i) 2.5?mg/L, and (e, j) a smooth copper substrate as reference.

Fig. 5. Surface morphologies of copper foils with various SPS concentrations: (a) 0?mg/L, (b) 0.3?mg/L, (c) 0.5?mg/L, (d) 0.8?mg/L, (e) 1.5?mg/L, (f) 2.5?mg/L.

Fig. 6. 3-D morphologies of the copper foils with SPS concentrations of (a) 0?mg/L, (c) 0.5?mg/L, (e) 1.5?mg/L, and (g) 2.5?mg/L. The scan area is 200?×?300?μm 2. (b), (d), (f), and (h) correspond to the cross-section profiles in (a), (c), (e), and (g), respectively.

Fig. 7. (a) XRD patterns and (b) texture coefficients of copper foils with various SPS concentrations.

Fig. 8. Cross-section images of copper foils with various SPS concentrations: (a) 0?mg/L, (b) 0.3?mg/L, (c) 0.5?mg/L, (d) 1.5?mg/L, (e) 2.5?mg/L.

Fig. 9. Grain size distributions of copper foils with various SPS concentrations: (a) 0?mg/L, (b) 0.3?mg/L, (c) 0.5?mg/L, (d) 1.5?mg/L, (e) 2.5?mg/L, (f) average grain size with various SPS concentrations.

Fig. 10. Relationship between the tensile strength and inverse square root of grain size.

Fig. 11. (a) LSV and (b) CP curves of the electrolyte with various SPS concentrations.

Fig. 12. Schematic illustration of the suppressing effect on copper deposits with SPS concentration of (a) 0?mg/L, (b) 1.5?mg/L, (c) 2.5?mg/L, respectively.

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