Fig. 1. Experimental setup for electrodeposition of copper on CNT wire samples.

Fig. 2. (a) As-received CNT wires, (b) Au-sputtered CNT wires, and (c) surface morphologies of the as-received CNT wires.

Fig. 3. (a) EDS spectrum and (b) elemental mapping of Au-sputtered CNT wires.

Fig. 4. (a) Stress-strain curves and (b) electrical properties of as-received and Au-sputtered CNT wires.

Fig. 5. SEM images and the insets showing the electrodeposition of Cu on (a) as-received CNT wires and (b) Au-sputtered CNT wires in 60 s.

Fig. 6. (a) Optical image and (b) SEM image of the CNT/Au/Cu composite wires after 1.5 h Cu deposition and (c) diameter and CNT volume fraction of the CNT/Au/Cu composite wires at different electrodeposition time.

Fig. 7. Resistance and electrical conductivity of the CNT/Au/Cu composite wires at different electrodeposition time.

Fig. 8. (a) Stress-strain curves, (b) tensile strength and stiffness and (c) cross-sectional area, tensile load, and elongation at failure of the CNT/Au/Cu composite wires at different electrodeposition time.

Fig. 9. Fracture morphologies of (a) as-received CNT wires and (b) CNT/Au/Cu composite wires.

Fig. 10. (a) Comparison of the tensile strength and electrical conductivity of the CNT/Au/Cu composite wires in this work with several metals [5] and the CNT/Cu composite wires fabricated from the dry-spun CNT wires without any post-treatments [[19], [20], [21]], (b) A 50 g LED lamp lit and suspended by two CNT/Au/Cu composite wires.