Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

J Mater Sci Technol ›› 2011, Vol. 27 ›› Issue (8): 741-745.

• Modeling and Simulations • Previous Articles Next Articles

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

T.Y. Kang¹⁾, Y.Y. Xiu²⁾, L. Hui²⁾, J.J. Wang²⁾, W.P. Tong¹⁾, C.Z. Liu²⁾

1) Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang 110004, China
2) Shenyang Aerospace University, Shenyang 110136, China

Received:2010-06-01 Revised:2010-08-26 Online:2011-08-30 Published:2011-08-30
Contact: C.Z. Liu; W.P. Tong
Supported by:
the National Natural Science Foundation of China (No. 50871026), the 111 Project (No. B07015), Foundation of National Excellent Doctoral Dissertation of China (No. 200745), Program for New Century Excellent Talents in University (No. NCET-06-0288), and the Fundamental Research Funds for the Central Universities (No. N090109001)

Abstract

Abstract: The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Q_a for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu₆Sn₅ was enhanced in compensation of reduced IMC Cu₃Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.

Key words: Solder, Interfacial reaction, Intermetallics, Kinetics

T.Y. Kang, Y.Y. Xiu, L. Hui, J.J. Wang, W.P. Tong, C.Z. Liu. Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect[J]. J Mater Sci Technol, 2011, 27(8): 741-745.

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Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

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