Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder

J Mater Sci Technol ›› 2012, Vol. 28 ›› Issue (7): 661-665.

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Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder

Wei Zhang, Ying Zhong, Chunqing Wang

State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

Received:2011-05-04 Revised:2011-12-01 Online:2012-07-28 Published:2012-07-28
Contact: Wei Zhang
Supported by:
the Scientific and Technological Development Projects in Shandong Province under Grant No. 2010GGX10307

Abstract

Abstract: Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260℃ for 60 seconds. Spreading areas of composite solder were calculated and distributions of copper-coated diamonds were characterized. When diamond additions are below 3wt%, the spreading area decreases with diamond additions, and diamonds distributes mainly at the interface between solder and Cu pad; however, when additions are beyond 3wt%, discharge of diamond particle occurs, and the spreading area increases due to the reduction of surface energy.

Key words: Sn3.0Ag0.5Cu, Diamond, Composite solder, Chemical plating

CLC Number:

TG425+.1

Wei Zhang, Ying Zhong, Chunqing Wang. Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder[J]. J Mater Sci Technol, 2012, 28(7): 661-665.

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Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder

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