Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder

J Mater Sci Technol ›› 2007, Vol. 23 ›› Issue (01): 81-84.

• Research Articles • Previous Articles Next Articles

Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder

Haitao MA, Haiping XIE, Lai WANG

State Key Laboratory of Materials Modification by Laser, Ion and Electron Beams, Dalian University of Technology, Dalian 116024, China...

Received:2005-12-22 Revised:2006-06-20 Online:2007-01-28 Published:2009-10-10
Contact: Lai WANG

Abstract

Abstract: The microstructure and melting behavior of Sn-9Zn-2Cu (SZC) lead-free solder with 3 wt pct Bi and various amount of Ni additions were studied. The wetting properties and the interfacial reaction of Sn-Zn-Cu with Cu substrate were also examined. The results indicated that the addition of 3 wt pct Bi could decrease the melting point of the solder and Ni would refine the microstructure and the rod-shape Cu5Zn8 phase changed into square-shape (Cu, Ni)5Zn8 phase. The addition of Bi, Ni greatly improved the wettability of SZC solder. In addition, the interfacial phase of the solders/Cu joint was typical planar Cu5Zn8 in SZC-3Bi-1Ni alloy.

Key words: Lead-free solder, Microstructure, Wetting property, Interfacial reaction, Intermetallic compounds

Haitao MA, Haiping XIE, Lai WANG. Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder[J]. J Mater Sci Technol, 2007, 23(01): 81-84.

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Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder

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