A novel hole cold-expansion method and its effect on surface integrity of nickel-based superalloy

doi:10.1016/j.jmst.2020.05.022

Abstract

Abstract:

Preferred surface integrity around the hole wall is one of the key parameters to ensure the optimized performance of hole components for nickel-based superalloy. The novel hole cold expansion technique introduced in this work involves the laser texturing process (LTP) followed by the Hertz contact rotary expansion process (HCREP), where the cylindrical sleeve is the critical component connecting the above-mentioned two processes. The purpose of LTP is to obtain the most optimized strengthened cylindrical sleeve surface, preparing for the following HCREP. Hereafter, the HCREP acts on the nickel-based hole components by the rotary extruding movements of the strengthened sleeve and conical mandrel tools. As compared to the as-received GH4169 material, the surface integrity characterization for the strengthened hole shows that a plastic deformation layer with finer grains, higher micro-hardness, deeper compressive residual stress (CRS) distribution and lower surface roughness is formed at the hole wall. In addition, transmission electron microscope (TEM) observations reveal the microstructure evolution mechanism in the strengthened hole. Grain refinement near the hole wall is regarded as the fundamental reason for improving the surface integrity, where the aggregated dislocations and recombined dislocation walls can be clearly observed.

Key words: Cold expansion process, Laser texturing process, Surface integrity, Microstructure evolution

XianCao Ping, ZhangShuang Liu, Xue-Lin Lei, Run-Zi Wang, Xian-Cheng Zhang, Shan-Tung Tu. A novel hole cold-expansion method and its effect on surface integrity of nickel-based superalloy[J]. J. Mater. Sci. Technol., 2020, 59: 129-137.

Figures/Tables 12

Table 1 Chemical compositions (wt.%) of the nickel-based GH4169 superalloy.

C	Cr	Mo	Nb	Ti	Al	P	Mn	S	Fe	Ni
0.023	17.86	2.98	5.38	0.99	0.57	0.012	0.03	0.001	18.75	Bal.

Fig. 1. Preparation process of sleeve.

Table 2 The detailed parameters of P and T in LTP.

Specimen ID	P (W/mm²)	T (μs)
LTP-1	3.06 × 10⁴	1000
LTP-2	3.06 × 10⁴	1400
LTP-3	3.06 × 10⁴	1800
LTP-4	3.57 × 10⁴	1000
LTP-5	3.57 × 10⁴	1400
LTP-6	3.57 × 10⁴	1800
LTP-7	4.07 × 10⁴	1000
LTP-8	4.07 × 10⁴	1400
LTP-9	4.07 × 10⁴	1800

Fig. 2. Schematic illustration of HCREP.

Fig. 3. Three-dimensional topographies of the laser-textured points for different laser power densities and laser pulse durations.

Fig. 4. The microhardness and the maximum height of the laser-textured points in different LTP parameters.

Fig. 5. Microscopic metallographic structures of the (a) untreated material and strengthened materials with expansion degrees of (b) 0.4 %, (c) 0.7 %, and (d) 1%.

Fig. 6. TEM images of the topmost surface of (a) AR and (b) HCREP-3, and (c) 30 μm, (d) 60 μm deep layer of the HCREP-3.

Fig. 7. The microhardness evolution curves with varied depth from the hole wall at different expansion degrees.

Fig. 8. The residual stresses of specimens with different expansion degrees: (a) 0.4 %, (b) 0.7 %, (c) 1%.

Fig. 9. Surface topographies of the (a) untreated specimen and the specimens with expansion degrees of (b) 0.4 %, (c) 0.7 %, and (d) 1%.

Fig. 10. Stress states of a point near the hole surface: (a) a point near the hole surface, (b) The symmetric cold expansion process, (c) The direct mandrel expansion process, (d) The HCREP.

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