J Mater Sci Technol ›› 2009, Vol. 25 ›› Issue (03): 347-350.

• Research Articles • Previous Articles     Next Articles

An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys

Haiqing Sun, Yinong Shi   

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 110016, China
  • Received:2008-08-25 Online:2009-05-28 Published:2009-10-10
  • Contact: Yinong Shi
  • Supported by:

    NSFC (No. 50431010 and No. 50621091), Ministry of Science & Technology of China (No. 2005CB623604)

Abstract:

Nanocrystalline Cu-Ni-P alloys with average grain sizes of 7, 10 and 24 nm were synthesized by means of electrodeposition. The grain size dependences of tensile strength and hardness of the nanocrystalline Cu alloys were investigated. The breakdown of Hall-Petch relation was exhibited in both tensile strength and hardness.

Key words: Nanomaterials, Mechanical properties, Hardness