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J Mater Sci Technol  2009, Vol. 25 Issue (03): 347-350    DOI:
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An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys
Haiqing Sun, Yinong Shi
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 110016, China
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Abstract  

Nanocrystalline Cu-Ni-P alloys with average grain sizes of 7, 10 and 24 nm were synthesized by means of electrodeposition. The grain size dependences of tensile strength and hardness of the nanocrystalline Cu alloys were investigated. The breakdown of Hall-Petch relation was exhibited in both tensile strength and hardness.

Key words:  Nanomaterials      Mechanical properties      Hardness     
Received:  25 August 2008     
Fund: 

NSFC (No. 50431010 and No. 50621091), Ministry of Science & Technology of China (No. 2005CB623604)

Corresponding Authors:  Yinong Shi     E-mail:  yinongshi@imr.ac.cn

Cite this article: 

Haiqing Sun,Yinong Shi. An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys. J Mater Sci Technol, 2009, 25(03): 347-350.

URL: 

https://www.jmst.org/EN/     OR     https://www.jmst.org/EN/Y2009/V25/I03/347

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