Quantitative mechanisms behind the high strength and electrical conductivity of Cu-Te alloy manufactured by continuous extrusion

doi:10.1016/j.jmst.2021.12.046

Abstract

Abstract:

The microstructure, mechanical performance, and electrical conductivity of Cu-Te alloy fabricated by continuous extrusion were quantitatively investigated. The results demonstrate that the grain size of the Cu-Te alloy is refined significantly by incomplete dynamic recrystallization. The Cu₂Te phase stimulates recrystallization and inhibits subgrain growth. After extrusion, the tensile strength increases from 217.8 ± 4.8 MPa to 242.5 ± 3.7 MPa, the yield strength increases from 65.1 ± 3.5 MPa to 104.3 ± 3.8 MPa, and the yield to tensile strength ratio is improved from 0.293 ± 0.015 to 0.43 ±.0.091, while the electrical conductivity of room temperature decreases from 95.8 ± 0.38% International Annealed Cu Standard (IACS) to 94.0% ± 0.32% IACS. The quantitative analysis shows that the increment caused by dislocation strengthening and boundary strengthening account for 84.6% of the yield strength of the extruded Cu-Te alloy and the electrical resistivity induced by grain boundaries and dislocations accounts for 1.6% of the electrical resistivity of the extruded Cu-Te alloy. Dislocations and boundaries contribute greatly to the increase of yield strength, but less to the increase of electrical resistivity.

Key words: Cu-Te alloy, Continuous extrusion, Microstructure, Electrical conductivity, Yield strength

Qianqian Fu, Bing Li, Minqiang Gao, Ying Fu, Rongzhou Yu, Changfeng Wang, Renguo Guan. Quantitative mechanisms behind the high strength and electrical conductivity of Cu-Te alloy manufactured by continuous extrusion[J]. J. Mater. Sci. Technol., 2022, 121: 9-18.

Figures/Tables 13

Fig. 1. Schematic illustration of the continuous extrusion process.

Table 1. Compositions of the Cu-Te alloy.

alloy	Cu (wt.%)	Te (wt.%)	P (wt.%)
Cu-Te	Bal.	0.55	0.00471

Fig. 2. Axial orientation SEM images of (a) billet and (b) extruded Cu-Te alloy and radial orientation SEM images of (c) billet and (d) extruded Cu-Te alloy.

Fig. 3. XRD pattern of Cu-Te alloy of billet.

Fig. 4. EBSD results of billet: (a) inverse pole figures, (b) statistical result of the grain size, and (c) distributions of misorientation angles.

Fig. 5. EBSD results of extruded alloy: (a) axial orientation inverse pole figures, (b) radial orientation inverse pole figures, (c) statistical result of the grain size, and (d) distributions of misorientation angles.

Fig. 6. The recrystallized, substructured, deformed regions, and proportional statistics of the extruded alloy: (a) and (c) axial orientation; (b) and (d) radial orientation.

Fig. 7. (a) TEM BF image of extruded Cu matrix; (b) nano-twins in Cu-Te alloy by continuous extrusion; the SAED patterns of (c) Cu matrix and (d) nano-twins; (e) high-resolution TEM of twins.

Fig. 8. (a) TEM image of Cu2Te phase; (b) the SAED pattern of Cu2Te phase; (c) HRTEM image of Cu2Te phase.

Fig. 9. ODF section diagram (φ2 = 30°) (a) before extrusion and (b) after extrusion.

Fig. 10. Stress-strain curves of billet and extruded rod.

Table 2. Yield strength increments caused by LAGBs and HAGBs of the Cu-Te alloy.

Alloy	f (%)	d (μm)	ρ (× 10¹⁴ m^-2)	σ_LAGB (MPa)	σ_HAGB (MPa)
Billet	97.1	9.44	0.0174	11.3	35.9
Extruded	51.1	1.16	0.203	38.6	74.3

Fig. 11. Comparison between the calculated and experimental yield strengths of billet and extruded alloy.

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