Ultrathin, flexible, and high-strength Ni/Cu/metallic glass/Cu/Ni composite with alternate magneto-electric structures for electromagnetic shielding

doi:10.1016/j.jmst.2020.12.012

Abstract

Abstract:

Electromagnetic interference (EMI) shielding materials with ultrathin, flexible, superior mechanical and thermal management properties are highly desirable for smart and wearable electronics. Here, ultrathin and flexible Ni/Cu/metallic glass/Cu/Ni (Ni/Cu/MG) multilayer composite with alternate magnetic and electrical structures was designed via facial electroless plating of Cu and Ni on an Fe-based metallic glass. The resultant 0.02 mm-thick Ni/Cu/MG composite displays a superior EMI shielding effectiveness (EMI SE) of 35 dB and a great EMI SE/t of 1750 dB/mm, which is greater than those of composites with monotonous multilayer or homogeneous structures. The improved EMI SE originates from the massive ohmic losses, the enhanced internal reflection/absorption, and the abundant interfacial polarization loss. Particularly, Ni/Cu/MG exhibits a high tensile strength of up to 1.2 GPa and outstanding mechanical stability, enabling the EMI SE remains unchanged after 10,000 times of bending. Moreover, Ni/Cu/MG has excellent Joule heating characteristics and thermal stability, which is very suitable for heating components of wearable hyperthermia devices.

Key words: Electromagnetic shielding, Thermal management, Mechanical properties, Fe-based metallic glasses, Alternate magnetic and electrical structures

Zenan Ma, Jiawei Li, Jijun Zhang, Aina He, Yaqiang Dong, Guoguo Tan, Mingqiang Ning, Qikui Man, Xincai Liu. Ultrathin, flexible, and high-strength Ni/Cu/metallic glass/Cu/Ni composite with alternate magneto-electric structures for electromagnetic shielding[J]. J. Mater. Sci. Technol., 2021, 81: 43-50.

Figures/Tables 7

Fig. 1. Fabrication and characterization of Ni/Cu/MG. (a) Schematic fabricating process and illustration. (b-e) Surface morphologies of MG, Ni/MG, Cu/MG and Ni/Cu/MG, respectively. (f-i) Enlarged images of (b-e). (j) Cross-sectional image. (k-m) Elemental distribution images.

Fig. 2. TEM microstructure of Ni/Cu/MG. (a) Cross-sectional bright-field image. The inset in (a) shows the SAED pattern. (b) HRTEM image, indicating the interdiffusion of Ni, Cu and MG.

Fig. 3. Electrical and magnetic properties of MG, Ni/MG, Cu/MG and Ni/Cu/MG. (a) Electrical conductivity. (b) Saturation magnetization.

Fig. 4. (a) EMI SE and (b) SET, SEA and SER of MG, Ni/MG, Cu/MG and Ni/Cu/MG. The dash lines are guides for eyes. (c) EMI shielding mechanism of Ni/Cu/MG.

Fig. 5. Power flow intensity distribution map. (a) Ni/Cu/MG. (b) Cu/MG. (c, d) Ni/MG with electroless Ni plating for 3 min and 7 min, respectively. All the power flow intensity is normalized, and the color from red to blue represents the EMWs vary from strong to weak.

Fig. 6. (a) Stress-strain curves of MG, Ni/MG, Cu/MG and Ni/Cu/MG at a strain rate of 10-4 m/s. (b) EMI SE/t versus tensile strength. Metals: blue triangle; Carbon materials: black squares; MXenes: orange diamond; Others: green circle; This work: red pentagram.

Fig. 7. Thermal management performance of Ni/Cu/MG. (a) Surface temperature as a function of time and applied voltage. (b) Variation of resistance with temperature. (c) Temperature-time curve at a constant voltage of 0.2 V. The inset in (c) displays the infrared thermal imaging photos during heating. The temperature in the inset represents the average temperature of the entire sample surface.

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