Effects of cold metal transfer mode on the reaction layer of wire and arc additive-manufactured Ti-6Al-4V/Al-6.25Cu dissimilar alloys

doi:10.1016/j.jmst.2020.09.014

Abstract

Abstract:

Components of Ti and Al dissimilar alloys were obtained by wire and arc additive manufacturing using two cold metal transfer (CMT) modes. Direct current CMT (DC-CMT) mode was used for Ti alloy deposition, and DC-CMT or CMT plus pulse (CMT + P) mode was used for the Al alloy deposition. During deposition of the first Al alloy layer, little and a significant amount of Ti alloy were melted using DC-CMT and CMT + P mode, respectively. TiAl₃ formed in the reaction layer when DC-CMT mode was used, while TiAl₃, TiAl, and Ti₃Al formed in the reaction layer when CMT + P mode was used. Compared to using DC-CMT mode, more cracks occurred when using CMT + P. The nanohardness of the reaction layer was between that of the Al and Ti alloys, irrespective of the CMT modes. The average tensile strengths of the samples using DC-CMT and CMT + P mode were 108 MPa and 24 MPa, respectively. DC-CMT mode was more suitable for the wire and arc additive manufacturing of Ti/Al dissimilar alloys.

Key words: Ti/Al dissimilar alloys, Wire and arc additive manufacturing, Reaction layer, Microstructure, Mechanical properties

Yinbao Tian, Junqi Shen, Shengsun Hu, Jian Gou, Yan Cui. Effects of cold metal transfer mode on the reaction layer of wire and arc additive-manufactured Ti-6Al-4V/Al-6.25Cu dissimilar alloys[J]. J. Mater. Sci. Technol., 2021, 74: 35-45.

Figures/Tables 20

Table 1 Chemical compositions of the filler materials (wt. %).

Material	Al	Ti	Cu	Si	Mg	Mn	Fe	Zn	Cr	Zr	V	C	N	H	O
Ti-6Al-4V	6.01	Bal.	-	-	-	-	0.15	-	-	-	3.96	0.012	0.016	0.02	0.17
Al-6.25Cu	Bal.	0.14	6.25	0.13	0.011	0.32	0.102	0.069	-	0.126	0.1	-	-	-	-

Fig. 1. Schematic of the sampling positions for microstructural examinations.

Table 2 Deposition parameters of WAAM process.

Sample	CMT mode for Ti alloy	CMT mode for Al alloy	WFS of Ti alloy (m/min)	WFS of Al alloy (m/min)	Travel speed (m/min)	Wire extension (mm)	Shielding gas flow rate (L/min)
1	DC-CMT	DC-CMT	7.2	4	0.3	12	20
2	DC-CMT	CMT + P	7.2	4	0.3	12	20

Fig. 2. Current and voltage waveforms of depositing Al alloys: (a) sample 1 and (b) sample 2.

Fig. 3. Images of droplet transfer of depositing Al alloys: (a) sample 1 and (b) sample 2. (Arrow indicates the direction of movement of the wire).

Fig. 4. Components fabricated using WAAM: (a) sample 1, (b) sample 2 and (c) transverse sections of samples 1 and 2.

Fig. 5. Microstructure of sample 1: (a) cross-section of the component and (b)-(d) magnified micrographs of areas A-C highlighted with the rectangles in (a).

Table 3 EDS results of the points in Fig. 5, Fig. 7 (at.%).

Point	Ti	Al	V	Cu	Possible phase
1	22.87	75.37	1.31	0.45	TiAl₃
2	22.69	75.87	1.05	0.39	TiAl₃
3	87.69	11.30	1.01	-	Ti
4	88.63	10.50	0.87	-	Ti
5	22.51	75.29	1.12	1.08	TiAl₃
6	-	62.07	-	37.93	Al₂Cu
7	25.30	73.10	1.21	0.39	TiAl₃
8	72.03	26.80	0.22	0.95	Ti₃Al
9	52.40	44.69	1.83	1.08	TiAl
10	88.03	9.87	2.10	-	Ti

Fig. 6. TEM analysis of the rectangle of sample 1 in (c): (a) TEM image and (b) electron diffraction pattern of area I.

Fig. 7. Microstructure of sample 2: (a) cross-section of the component and (b)-(f) magnified micrographs of areas A-E highlighted with rectangles in (a).

Fig. 8. TEM analysis of area B of sample 2: (a) TEM image, (b) electron diffraction pattern of area II, and (c) electron diffraction pattern of area III.

Fig. 9. TEM analysis of area D of sample 2: (a) TEM image, (b) electron diffraction pattern of area IV, and (c) electron diffraction pattern of area V.

Fig. 10. EDS line scans of reaction layer: (a) sample 1 and (b) sample 2.

Fig. 11. Schematic of reaction layer formation for sample 1.

Fig. 12. Schematic of reaction layer formation for sample 2.

Fig. 13. Cracks in sample 1.

Fig. 14. Cracks in sample 2: (a) crack in the transition area near Ti alloy, (b) crack in the interface layer, and (c) magnified micrographs of rectangular area from (b).

Fig. 15. Load-displacement curves: (a) sample 1 and (b) sample 2.

Fig. 16. Tensile stress-strain curves and the corresponding position of fracture: (a) sample 1 and (b) sample 2.

Fig. 17. Fracture surfaces: (a) Al alloy side of sample 1, (b) magnified micrograph of the rectangular area in (a), (c) Ti alloy side of sample 1, (d) magnified micrograph of the rectangular area in (c), (e) Al alloy side of sample 2, (f) magnified micrograph of the rectangular area in (e), (g) Ti alloy side of sample 2, and (h) magnified micrograph of the rectangular area in (g).

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