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J Mater Sci Technol  2009, Vol. 25 Issue (03): 410-414    DOI:
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Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging
Ning Zhao, Haitao Ma, Haiping Xie, Lai Wang
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
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Abstract  

The wetting property of (Sn-9Zn)-2Cu (wt pct) on Ni substrate and the evolution of interfacial microstructure in (Sn-9Zn)-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting ability of eutectic Sn-9Zn solder on Ni substrate was markedly improved by adding 2 wt pct Cu into this solder alloy. Plate-like Cu5Zn8 intermetallic compounds (IMCs) were detected in (Sn-9Zn)-2Cu solder matrix. A continuous Ni5Zn21 IMC layer was formed at (Sn-9Zn)-2Cu/Ni interface after soldering. This IMC layer kept its type and integrality even after aging at 170°C for up to 1000 h. At the early aging stage (before 500 h), the IMC layer grew fast and its thickness followed a linear relationship with the square root of aging time. Thereafter, however, the thickness increased very slowly with longer aging time. When the joints were aged for 1000 h,
a new IMC phase, (Cu,Ni)5Zn8, was found in the matrix near the interface. The formation of (Cu,Ni)5Zn8 phase can be attributed to the di®usion of Ni atoms into the solder matrix from the substrate.

Key words:  Lead-free solder      Interfacial reaction      Intermetallic compounds      Aging     
Received:  21 April 2008     
Fund: 

the National Key Project of Scientific and Technical Supporting Programs during the 11th Five-year Plan (No. 2006BAE03B02-2) 
NSFC Key Program (No. U0734006)

Cite this article: 

Ning Zhao,Haitao Ma,Haiping Xie,Lai Wang. Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging. J Mater Sci Technol, 2009, 25(03): 410-414.

URL: 

https://www.jmst.org/EN/     OR     https://www.jmst.org/EN/Y2009/V25/I03/410

[1 ] A.A. Lin, H.K. King, K.N. Tu and P.A. Yotta: J. Appl. Phys., 1996, 80(5), 2774.
[2 ] H.K. Kim, H.K. Liou and K.N. Tu: Appl. Phys. Lett., 1995, 66(18), 2337.
[3 ] H.K. Kim and K.N. Tu: Phys. Rev. B, 1996, 53(23), 16027.
[4 ] K.H. Prakash and T. Sritharan: Acta Mater., 2001, 49(13), 2481.
[5 ] F.Q. Li, C.Q. Wang and Y.H. Tian: J. Mater. Sci. Technol., 2006, 22(3), 392.
[6 ] A. Sharif and Y.C. Chan: Mater. Sci. Eng. B, 2004, 106(2), 126.
[7 ] K.N. Tu and K. Zeng: Mater. Sci. Eng. R, 2001, 34(1), 1.
[8 ] N.C. Lee: Soldering & Surface Mount Technology, 1997, 9(2), 65.
[9 ] P.T. Vianco and D.R. Frear: J. Minerals Metals & Materials Society, 1993, 45(7), 14.
[10] C.M.L. Wu, D.Q. Yu, C.M.T. Law and L. Wang: J. Electron. Mater., 2002, 31(9), 921.
[11] M. Abtew and G. Selvaduray: Mater. Sci. Eng., 2000, 27(5-6), 95.
[12] D.Q. Yu, C.M.L. Wu, D.P. He, N. Zhao, L. Wang and J.K.L. Lai: J. Mater. Res., 2005, 20(8), 2205.
[13] M.L. Huang, T. Loeher, A. Ostmann and H. Reichl: Appl. Phys. Lett., 2005, 86(18), 181908.
[14] W.T. Chen, C.E. Ho and C.R. Kao: J. Mater. Res., 2002, 17(2), 263.
[15] C.S. Huang, J.G. Duh, Y.M. Chen and J.H. Wang: J. Electron. Mater., 2003, 32(2), 89.
[16] L.L. Duan, D.Q. Yu, S.Q. Han, J. Zhao and L. Wang: in Proc. of Int. Conf. on the Business of Electronic Product Reliability and Liability, Shanghai, China, 2004, 35.
[17] R.K. Shiue, L.W. Tsay, C.L. Lin and J.L. Ou: Microelectron. Reliab., 2003, 43(3), 453.
[18] K.S. Kim, J.M. Yang, C.H. Yu, I.O. Jung and H.H. Kim: J. Alloys Compd., 2004, 379(1-2), 314.
[19] H.P. Xie, D.Q. Yu, H.T. Ma and L. Wang: Chin. J. Nonferrous. Met., 2004, 14(10), 1694. (in Chinese)
[20] D.Q. Yu, H.P. Xie and L. Wang: J. Alloys Compd., 2004, 385(1-2), 119.
[21] S. Ikuo, N. Takao, M. Fuminari and F. Shinichi: Mater. Trans., 2002, 43(8), 1797. Volume 25 Number 3 pp 289-432 2009

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