Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging

Abstract

Abstract:

The wetting property of (Sn-9Zn)-2Cu (wt pct) on Ni substrate and the evolution of interfacial microstructure in (Sn-9Zn)-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting ability of eutectic Sn-9Zn solder on Ni substrate was markedly improved by adding 2 wt pct Cu into this solder alloy. Plate-like Cu5Zn8 intermetallic compounds (IMCs) were detected in (Sn-9Zn)-2Cu solder matrix. A continuous Ni₅Zn₂₁ IMC layer was formed at (Sn-9Zn)-2Cu/Ni interface after soldering. This IMC layer kept its type and integrality even after aging at 170°C for up to 1000 h. At the early aging stage (before 500 h), the IMC layer grew fast and its thickness followed a linear relationship with the square root of aging time. Thereafter, however, the thickness increased very slowly with longer aging time. When the joints were aged for 1000 h,
a new IMC phase, (Cu,Ni)₅Zn₈, was found in the matrix near the interface. The formation of (Cu,Ni)₅Zn₈ phase can be attributed to the di®usion of Ni atoms into the solder matrix from the substrate.

Key words: Lead-free solder, Interfacial reaction, Intermetallic compounds, Aging

Ning Zhao,Haitao Ma,Haiping Xie,Lai Wang. Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging[J]. J Mater Sci Technol, 2009, 25(03): 410-414.

References

[1 ] A.A. Lin, H.K. King, K.N. Tu and P.A. Yotta: J. Appl. Phys., 1996, 80(5), 2774.
[2 ] H.K. Kim, H.K. Liou and K.N. Tu: Appl. Phys. Lett., 1995, 66(18), 2337.
[3 ] H.K. Kim and K.N. Tu: Phys. Rev. B, 1996, 53(23), 16027.
[4 ] K.H. Prakash and T. Sritharan: Acta Mater., 2001, 49(13), 2481.
[5 ] F.Q. Li, C.Q. Wang and Y.H. Tian: J. Mater. Sci. Technol., 2006, 22(3), 392.
[6 ] A. Sharif and Y.C. Chan: Mater. Sci. Eng. B, 2004, 106(2), 126.
[7 ] K.N. Tu and K. Zeng: Mater. Sci. Eng. R, 2001, 34(1), 1.
[8 ] N.C. Lee: Soldering & Surface Mount Technology, 1997, 9(2), 65.
[9 ] P.T. Vianco and D.R. Frear: J. Minerals Metals & Materials Society, 1993, 45(7), 14.
[10] C.M.L. Wu, D.Q. Yu, C.M.T. Law and L. Wang: J. Electron. Mater., 2002, 31(9), 921.
[11] M. Abtew and G. Selvaduray: Mater. Sci. Eng., 2000, 27(5-6), 95.
[12] D.Q. Yu, C.M.L. Wu, D.P. He, N. Zhao, L. Wang and J.K.L. Lai: J. Mater. Res., 2005, 20(8), 2205.
[13] M.L. Huang, T. Loeher, A. Ostmann and H. Reichl: Appl. Phys. Lett., 2005, 86(18), 181908.
[14] W.T. Chen, C.E. Ho and C.R. Kao: J. Mater. Res., 2002, 17(2), 263.
[15] C.S. Huang, J.G. Duh, Y.M. Chen and J.H. Wang: J. Electron. Mater., 2003, 32(2), 89.
[16] L.L. Duan, D.Q. Yu, S.Q. Han, J. Zhao and L. Wang: in Proc. of Int. Conf. on the Business of Electronic Product Reliability and Liability, Shanghai, China, 2004, 35.
[17] R.K. Shiue, L.W. Tsay, C.L. Lin and J.L. Ou: Microelectron. Reliab., 2003, 43(3), 453.
[18] K.S. Kim, J.M. Yang, C.H. Yu, I.O. Jung and H.H. Kim: J. Alloys Compd., 2004, 379(1-2), 314.
[19] H.P. Xie, D.Q. Yu, H.T. Ma and L. Wang: Chin. J. Nonferrous. Met., 2004, 14(10), 1694. (in Chinese)
[20] D.Q. Yu, H.P. Xie and L. Wang: J. Alloys Compd., 2004, 385(1-2), 119.
[21] S. Ikuo, N. Takao, M. Fuminari and F. Shinichi: Mater. Trans., 2002, 43(8), 1797. Volume 25 Number 3 pp 289-432 2009

[1]	Kaiming Cheng, Jiaxing Sun, Huixia Xu, Jin Wang, Chengwei Zhan, Reza Ghomashchi, Jixue Zhou, Shouqiu Tang, Lijun Zhang, Yong Du. Diffusion growth of ϕ ternary intermetallic compound in the Mg-Al-Zn alloy system: In-situ observation and modeling [J]. J. Mater. Sci. Technol., 2021, 60(0): 222-229.
[2]	Lin Gao, Kai Li, Song Ni, Yong Du, Min Song. The growth mechanisms of θ′ precipitate phase in an Al-Cu alloy during aging treatment [J]. J. Mater. Sci. Technol., 2021, 61(0): 25-32.
[3]	Yang Wang, Shun Zhang, Ruizhi Wu, Nodir Turakhodjaev, Legan Hou, Jinghuai Zhang, Sergey Betsofen. Coarsening kinetics and strengthening mechanisms of core-shell nanoscale precipitates in Al-Li-Yb-Er-Sc-Zr alloy [J]. J. Mater. Sci. Technol., 2021, 61(0): 197-203.
[4]	Xiaoqiang Li, Chunlong Cheng, Qichi Le, Lei Bao, Peipeng Jin, Ping Wang, Liang Ren, Hang Wang, Xiong Zhou, Chenglu Hu. Investigation of Portevin-Le Chatelier effect in rolled α-phase Mg-Li alloy during tensile and compressive deformation [J]. J. Mater. Sci. Technol., 2020, 52(0): 152-161.
[5]	Z.Y. Zhang, L.X. Sun, N.R. Tao. Nanostructures and nanoprecipitates induce high strength and high electrical conductivity in a CuCrZr alloy [J]. J. Mater. Sci. Technol., 2020, 48(0): 18-22.
[6]	Chaoyu Han, Shibo Wen, Feng Ye, Wenjia Wu, Shaowei Xue, Yongfeng Liang, Binbin Liu, Junpin Lin. Deformation twinning in equiaxed-grained Fe-6.5 wt.%Si alloy after rotary swaging [J]. J. Mater. Sci. Technol., 2020, 49(0): 25-34.
[7]	Langlang Zhao, Shitong Wei, Dong Wu, Dianbao Gao, Shanping Lu. δ-ferrite transformation mechanism and its effect on mechanical properties of 316H weld metal [J]. J. Mater. Sci. Technol., 2020, 57(0): 33-42.
[8]	Gang Lu, Shuai Nie, Jianjun Wang, Ying Zhang, Tianhai Wu, Yujie Liu, Chunming Liu. Enhancing the bake-hardening responses of a pre-aged Al-Mg-Si alloy by trace Sn additions [J]. J. Mater. Sci. Technol., 2020, 40(0): 107-112.
[9]	Zhiqiang Zhang, Changshu He, Ying Li, Lei Yu, Su Zhao, Xiang Zhao. Effects of ultrasonic assisted friction stir welding on flow behavior, microstructure and mechanical properties of 7N01-T4 aluminum alloy joints [J]. J. Mater. Sci. Technol., 2020, 43(0): 1-13.
[10]	Yanke Liu, Yulong Cai, Chenggang Tian, Guoliang Zhang, Guoming Han, Shihua Fu, Chuanyong Cui, Qingchuan Zhang. Experimental investigation of a Portevin-Le Chatelier band in Ni‒Co-based superalloys in relation to γʹ precipitates at 500 ℃ [J]. J. Mater. Sci. Technol., 2020, 49(0): 35-41.
[11]	Zongye Ding, Qiaodan Hu, Wenquan Lu, Fan Yang, Yihan Zhou, Naifang Zhang, Sheng Cao, Liao Yu, Jianguo Li. Intergrowth mechanism and morphology prediction of faceted Al₃Ni formed during solidification by a spatial geometric model [J]. J. Mater. Sci. Technol., 2020, 54(0): 40-47.
[12]	Yuanhao Dong, Sansan Shuai, Tianxiang Zheng, Jiawei Cao, Chaoyue Chen, Jiang Wang, Zhongming Ren. In-situ observation of solid-liquid interface transition during directional solidification of Al-Zn alloy via X-ray imaging [J]. J. Mater. Sci. Technol., 2020, 39(0): 113-123.
[13]	Anil Kunwar, Lili An, Jiahui Liu, Shengyan Shang, Peter Råback, Haitao Ma, Xueguan Song. A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering [J]. J. Mater. Sci. Technol., 2020, 50(0): 115-127.
[14]	Zongye Ding, Qiaodan Hu, Wenquan Lu, Xuan Ge, Sheng Cao, Siyu Sun, Tianxing Yang, Mingxu Xia, Jianguo Li. In-situ study on hydrogen bubble evolution in the liquid Al/solid Ni interconnection by synchrotron radiation X-ray radiography [J]. J. Mater. Sci. Technol., 2019, 35(7): 1388-1392.
[15]	J.C. Qiao, Y.H. Chen, R. Casalini, J.M. Pelletier, Y. Yao. Main α relaxation and slow β relaxation processes in a La₃₀Ce₃₀Al₁₅Co₂₅ metallic glass [J]. J. Mater. Sci. Technol., 2019, 35(6): 982-986.