Optimized strength and conductivity of multi-scale copper alloy/metallic glass composites tuned by a one-step spark plasma sintering (SPS) process

doi:10.1016/j.jmst.2022.04.024

Abstract

Abstract:

A superiority in interfacial bonding is favorable to fabricate high-strength conductive composites for electrical contact applications. In the present work, high strength and high conductivity multi-scale metallic glass composites (including micron-scale CuZrAl metallic glass reinforcement, hundred-nanometer-scale CuCrZr crystalline grain matrix, and nano-scale precipitated phase) were fabricated by a one-step spark plasma sintering (SPS). The strength and conductivity of the bulk copper matrix metallic glass composites (BCMGCs) were enhanced simultaneously with the increase in the sintering pressure of the SPS. The excellent performance is attributed to the improved interfacial bonding between the metallic glass reinforcement and the copper alloy matrix due to the high pressure assisted by temperature and pulsed current. In particular, the precipitation of nanoprecipitates at the interface further reduces the interfacial resistance and improves the mechanical properties of the composites. This work broadens the horizon for the selection and optimization of reinforcements and manufacturing processes for high-performance electrical contact materials (ECMs).

Key words: CuZrAl metallic glass, Spark plasma sintering, Mechanical properties, Electrical performance

Bao Weizong, Chen Jie, Xie Guoqiang. Optimized strength and conductivity of multi-scale copper alloy/metallic glass composites tuned by a one-step spark plasma sintering (SPS) process[J]. J. Mater. Sci. Technol., 2022, 128: 22-30.

Figures/Tables 14

Fig. 1. Sintering program setting of SPS. (a) loading pressure as a variable; (b) sintering temperature as a variable.

Fig. 2. Surface morphologies of (a) CuZrAl metallic glass powders, (b) CuCrZr alloy powders, and (c) composite powders; (d) ccorresponding XRD patterns.

Fig. 3. SEM micrographs of BCMGCs fabricated at different sintering pressures of (a) 100 MPa, (b) 300 MPa, and (c) 500 MPa; (d) EDS results of (c); (e) EBSD patterns of CuCrZr phase at 500 MPa; (f) grain size distribution of (e).

Table 1. Density of BCMGCs fabricated at different sintering pressures.

Sintering pressure (MPa)	100	200	300	400	500
Density (g/cm³)	7.254 ± 0.044	7.912 ± 0.019	8.291 ± 0.021	8.332 ± 0.014	8.341 ± 0.011

Fig. 4. (a) XRD patterns obtained from BCMGCs fabricated at different sintering pressures, (b) partially magnified region of (a).

Fig. 5. (a) Engineering stress-strain curves of BCMGCs fabricated at different sintering pressures, (b) variation of electrical conductivity of BCMGCs with sintering pressures.

Fig. 6. (a) XRD patterns obtained from BCMGCs fabricated at different sintering temperatures, (b) partially magnified region of (a).

Fig. 7. (a) TEM image of the interface morphology of the BCMGCs sintered at 693 K; HRTEM image of (b) CuCrZr alloy phase and (c) CuZrAl metallic glass phase; (e) TEM image of the interface morphology and (f) precipitates of the BCMGCs sintered at 723 K. (e-1) SAED pattern corresponding to CuCrZr alloy phase, (e-2) CuZrAl metallic glass phase, and (f-1) precipitate phase.

Fig. 8. (a) Engineering stress-strain curves of BCMGCs sintered at different temperatures, (b) variation of electrical conductivity of BCMGCs with sintering temperatures.

Table 2. Grain size and dislocation density of BCMGCs fabricated at different sintering parameters.

Pressure optimization			Temperature optimization
Pressure (MPa)	Grain size (nm)	Dislocation density (10¹⁴ m^-2)	Temperature (K)	Grain size (nm)	Dislocation density (10¹⁴ m^-2)
100	562	1.11	693	392	0.53
200	460	0.74	703	403	0.57
300	402	0.57	713	409	0.59
400	394	0.54	723	441	0.68
500	377	0.49	733	451	0.71

Fig. 9. Contributions of σGB, σDis, σss, and σot to YS of BCMGCs fabricated at different (a) sintering pressures and (b) sintering temperatures.

Fig. 10. Fracture surface micrographs, EDS analysis, and interfacial microstructure evolution schematic diagram of the BCMGCs specimens fabricated at different sintering pressures: (a-c) 100 MPa, (d-f) 300 MPa, (g-i) 500 MPa.

Fig. 11. (a) TEM image of the BCMGCs sintered at 723 K and 500 MPa; (b) corresponding interfacial microstructure evolution before and after fracture; SEM images of the fracture morphology for the BCMGCs specimens sintered at (c) 693 K and (d) 723 K.

Fig. 12. Conductivity and YS of BCMGCs compared with previous reports.

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