Investigation on peritectic solidification in Sn-Ni peritectic alloys through in-situ observation

doi:10.1016/j.jmst.2021.01.094

Abstract

Abstract:

The solidification of Sn-Ni peritectic alloys in which both the primary Ni₃Sn₂ and peritectic Ni₃Sn₄ phases were intermetallic compound phases (IMCs) with narrow solubility ranges was investigated through confocal laser scanning microscope. Analysis on the interface migration at different cooling rates shows that the rate of peritectic reaction is much smaller than previous reports, and the growth of peritectic phase is mainly attributed to direct precipitation from the melt in Sn-Ni alloy after peritectic reaction. In addition, different from other peritectic alloys where the solidified phases are solid solution phases, the "step" growth of both Ni₃Sn₂ and Ni₃Sn₄ phases was observed. The dependences of the step thickness on both the cooling rate and solidification time were measured, which shows that the step thicknesses of both phases gradually decrease as solidification proceeds. This was confirmed to be attributed to the difference between the actual and equilibrium melt concentrations during solidification. In addition, the increase of the normal growth velocity of Ni₃Sn₄ phase with increasing cooling rate was also proved through both the experimental observation and quantitative prediction.

Key words: Peritectic solidification, Solidification microstructure, Image analysis, Alloys, Microstructure

Peng Peng, Anqiao Zhang, Jinmian Yue, Shengyuan Li, Wanchao Zheng, Li Lu. Investigation on peritectic solidification in Sn-Ni peritectic alloys through in-situ observation[J]. J. Mater. Sci. Technol., 2021, 90: 236-242.

Figures/Tables 7

Fig. 1. The equilibrium phase diagram of binary Sn-Ni peritectic alloy, and the solid lines show the compositions of alloys in this work.

Fig. 2. Typical presentation of the peritectic solidification process in Sn-30 at.% Ni alloy through HTCLSM at the cooling rate of 0.33 °C/s: (a) progression of the advancing liquid/Ni3Sn2 interface at 0 s, 799.6 °C; (b) progression of the advancing liquid/Ni3Sn2 interface at 1.3 s, 799.3 °C; (c) nucleation of the peritectic Ni3Sn4 phase at 1.5 s, 798.3 °C; (d) growth of peritectic Ni3Sn4 phase along the liquid/Ni3Sn2 interface at 3.3 s, 797.9 °C; (e) growth of peritectic Ni3Sn4 phase at 6.6 s, 797.4 °C; (f) growth of peritectic Ni3Sn4 phase at 14.4 s, 797.2 °C; (g) growth of peritectic Ni3Sn4 phase at 26.3 s, 796.8 °C; (h) growth of peritectic Ni3Sn4 phase at 35.7 s, 796.1 °C.

Fig. 3. Typical presentation of the "step" growth of both Ni3Sn2 and Ni3Sn4 phases in through HTCLSM: (a) Sn-30 at.% Ni, at the cooling rate of 6.5 K/s; (b) Sn-30 at.% Ni, at the cooling rate of 4 K/s; (c) Sn-26 at.% Ni, at the cooling rate of 5 K/s.

Fig. 4. Analysis on the step growth of Ni3Sn2 and Ni3Sn4 phases during solidification: (a) the dependences of the step thickness Lα on the local position and cooling rate in Sn-30 at.% Ni alloy, (b) the dependences of the step thickness Lα on the local position and cooling rate in Sn-26 at.% Ni alloy, (c) the dependences of the step thickness Lβ on the local position and cooling rate in Sn-30 at.% Ni alloy, (b) the dependences of the step thickness Lβ on the local position and cooling rate in Sn-26 at.% Ni alloy, (e) dependences of |T(CL?CE)/CE| on solidification time at different cooling rates in Sn-30 at.% Ni alloy, (f) dependences of |T(CL?CE)/CE| on solidification time at different cooling rates in Sn-26 at.% Ni alloy.

Fig. 5. Investigation on the growth of peritectic Ni3Sn4 phase by different mechanisms: (a) comparison between the measurements and the predictions of the lateral propagation velocity of the peritectic Ni3Sn4 phase by the Bosze and Trivedi model in Sn-30% Ni alloy; (b) comparison between the measurements and the predictions of the lateral propagation velocity of the peritectic Ni3Sn4 phase by the Bosze and Trivedi model in Sn-26 at.% Ni alloys; (c) the growth velocity of peritectic Ni3Sn4 phase and the average migration velocities of the Ni3Sn2/Ni3Sn4 and L/Ni3Sn4 interfaces in Sn-30% Ni alloy; (d) the growth velocity of peritectic Ni3Sn4 phase and the average migration velocities of the Ni3Sn2/Ni3Sn4 and L/Ni3Sn4 interfaces in Sn-26% Ni alloy.

Fig. 6. The dependence of the migration distance and velocity of the L/Ni3Sn4 interface on cooling rates: (a) Sn-30% Ni and (b) Sn-26 at.% Ni alloys.

Fig. 7. The prediction of the dependence of the migration velocity of the L/Ni3Sn4 interface on cooling rates: (a) Sn-30% Ni and (b) Sn-26 at.% Ni alloys.

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