Ultrasound-Assisted Transient Liquid Phase Bonding of Magnesium Alloy Using Brass Interlayer in Air

doi:10.1016/j.jmst.2016.11.002

Abstract

Abstract:

The microstructure evolution and oxide film behavior in ultrasound-assisted transient liquid phase (U-TLP) bonding of Mg alloy were investigated by applying different ultrasonic time at 460 °C with brass interlayer in air. The results indicated that with increasing ultrasonic time, brass interlayer disappeared gradually and the Mg-Cu-Zn eutectic compounds were formed. The eutectic compounds in the joint decreased as the ultrasonic time increased further. The oxide removal process was divided into four steps. Continuous oxide film at the interface was partially fractured by ultrasonic vibration, and then suspended into liquid by undermining eutectic reaction. After that, the suspended oxide film was broken into small oxide fragments by ultrasonic cavitation effect, which was finally squeezed out of the joint by ultrasonic squeeze action. In addition, the mechanical properties of the joints were investigated. The maximum shear strength of the joint reached 105 MPa, which was 100% of base metal.

Key words: Magnesium alloy, Bonding, Ultrasound, Oxide film, Microstructure

Lai Zhiwei, Xie Ruishan, Pan Chuan, Chen Xiaoguang, Liu Lei, Wang Wenxian, Zou Guisheng. Ultrasound-Assisted Transient Liquid Phase Bonding of Magnesium Alloy Using Brass Interlayer in Air[J]. J. Mater. Sci. Technol., 2017, 33(6): 567-572.

Figures/Tables 9

Fig. 1. Schematic diagram of U-TLP bonding process.

Fig. 2. Microstructure evolution of the joint with different ultrasonic time at 460 °C: (a and b) 6 s; (c and d) 9 s; (e and f) 12 s; (g and h) 30 s; (i) 60 s; (j) 90 s.

Table 1. Chemical composition at different regions in Fig. 2

Region	Mg (at.%)	Cu (at.%)	Zn (at.%)	Mn (at.%)	Ce (at.%)	Possible phase
A	0.0	64.9	35.1	0.0	0.0	Cu_0.64Zn_0.36
B	42.1	29.9	28.0	0.0	0.0	CuMgZn
C	69.4	26.8	3.8	0.0	0.0	Mg₂Cu
D	39.3	31.5	28.5	0.6	0.1	CuMgZn
E	93.8	4.8	1.1	0.3	0.0	α-Mg
F	38.4	32.1	28.8	0.6	0.1	CuMgZn
G	67.3	25.9	5.8	1.0	0.0	Mg₂Cu
H	82.2	9.8	7.4	0.5	0.2	α-Mg + CuMgZn + Mg₂Cu
I	98.1	0.7	0.6	0.5	0.1	α-Mg

Fig. 3. SEM images of the interface between Mg and brass for ultrasonic time of (a) 9 s and (d) 12 s; (b) and (c) EDS analysis results in (a); (e) and (f) EDS analysis results in (d).

Fig. 4. XRD pattern of the fractured surface of the joint made with 12 s ultrasonic.

Fig. 5. Oxide removal model in U-TLP bonding process.

Fig. 6. Hardness across the interface of the joint made with 90 s ultrasonic.

Fig. 7. Shear strength evolution of the joint with different ultrasonic time.

Fig. 8. Fracture surface of the joint: (a) 9 s; (b) 30 s; (c) 60 s.

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