Effects of Forging and Heat Treatments on the Microstructure and Oxidation Behavior of 316LN Stainless Steel in High Temperature Water

doi:10.1016/j.jmst.2014.08.014

Abstract

Abstract: Microstructure of 316LN stainless steel (ss), including the as-received material and samples processed by solution anneal treatment and stress relief treatment after forging, was characterized by Vickers hardness (HV) testing and electron back scattering diffraction (EBSD). The oxide film formed on samples after immersion in borated and lithiated water at 583.15 K was investigated by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Results showed that the grain size of samples was largely reduced after forging. Higher fraction of coincidence site lattice (CSL) boundaries and lower residual strain were observed in samples with either solution anneal treatment or stress relief treatment. The proportion of CSL boundaries was largely enhanced by solution anneal treatment after forging, due to the recrystallization occurring during solution anneal treatment. The oxide film grown on 316LNss with solution anneal treatment after forging exhibited more strong protectiveness, as compared to the oxide film grown on samples with stress relief treatment after forging and the oxide film grown on as-received samples without forging. The mechanisms of oxidation were then discussed.

Key words: Stainless steel, Forging, Corrosion, Residual strain, Oxide film

Yueling Guo, En-Hou Han, Jianqiu Wang. Effects of Forging and Heat Treatments on the Microstructure and Oxidation Behavior of 316LN Stainless Steel in High Temperature Water[J]. J. Mater. Sci. Technol., 2015, 31(4): 403-412.

Figures/Tables 13

Process diagrams of forging and heat treatments followed: (a) forging followed by solution anneal treatment, (b) forging followed by stress relief treatment.

Microstructures of the three kinds of samples obtained by EBSD: (a) S0, samples without forging

(b) S41, samples with solution anneal treatment after forging

Grain boundary mappings of the three kinds of samples: (a) S0, (b) S41, (c) S42. In the grain boundary mappings, the red, blue and green lines refer to CSL boundaries, RGB and LAB, respectively. The background is grain average IQ (image quality).

Grain boundary character distribution (GBCD) of the samples.

Distributions of deviation angles between Σ

3 grain boundaries in samples and the ideal ones.

Vickers hardness scales of the three kinds of samples.

Kernel average misorientation (KAM) mappings of the three kinds of samples: (a) S0, (b) S41, (c) S42. Black lines refer to grain boundaries.

[001] inverse pole figure (IPF) mappings of the three kinds of samples: (a) S0, (b) S41, (c) S42.

Distributions of the misorientations along the lines on the IPFs shown in Fig.7 of the three samples.

SEM morphologies of the oxide ﬁ

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