Effects of Chloride Ion on the Texture of Copper and Cu-ZrB2 Coatings Electrodeposited from Copper Nitrate Solution in Different Plating Modes

Abstract

Abstract: For the first time, the texture of copper and Cu-ZrB2 coatings produced from copper nitrate solution was studied. Chloride ion shows different effects on the deposit texture under direct current (DC) and pulse current (PC) conditions. Copper deposits are strongly <220> textured in DC plating with and without chloride ion. While in PC condition, the predominant texture shifts from <220> to <200> as the chloride ion concentration exceeds 20 mg/l. The addition of ZrB2 particles enhances the cathodic polarization of copper deposition, which improves the growth of (111) plane. However, this improvement can be eliminated by further addition of chloride ion.

Key words: Texture, Chloride ion, Pulse plating, Coatings

Dongming GUO, Min ZHANG, Zhuji JIN, Renke KANG. Effects of Chloride Ion on the Texture of Copper and Cu-ZrB2 Coatings Electrodeposited from Copper Nitrate Solution in Different Plating Modes[J]. J Mater Sci Technol, 2006, 22(05): 643-646.

References

[1] D.Y.Li and K.Osseo-Asare: J. Mater. Sci., 1997, 32, 5525.
[2] X.P.Ye, M.De Bonte, J.P.Celis and J.R.Roos: J. Electrochem. Soc., 1992, 139(6), 1592.
[3] T.J.O'Keefe and L.R.Hurst: J. Appl. Electrocbem., 1978, 8, 109.
[4] N.Pradhan, P.G.Krishna and S.C.Das: Plat. Surf. Finish., 1996, 83(3), 56.
[5] Z.Nagy, J.P.Blaudeau, N.C.Hung, L.A.Curtiss and D.J.Zurawski: J. Electrocbem. Soc., 1995, 142(6), L87.
[6] V.I.Lakshmanan, D.J.Mackinnon and J.M.Brannen: J. Appl. Electrocbem., 1977, 7, 81.
[7] J.P.Healy and D.Pletcher: J. Electroanal. Chem., 1992, 338, 155.
[8] D.M.Soares, S.Wasle, K.G.Weil and K.Doblhofer: J. Electroanal. Chem., 2002, 532, 353.
[9] G.G.Lang, M.Ujvari and G.Horanyi: J. Electroanal. Chem., 2002, 522, 179.
[10] C.Gabrielli, P.Mocoteguy, H.Perrot and R.Wiart: J. Electroanal. Chem., 2004, 572, 367.
[11] D.N.Lee, S.Y.Kang and J.Yang: Plat. Surf. Finish., 1995, 82(3), 76.
[12] I.Handreg, P.Klimanek, G.Lange and M.Schneider: Mater. Sci. Forum, 1996, 228-231, 463.
[13] H.J.Lee and D.N.Lee: Mater. Sci. Forum, 2002, 408- 412, 1657.
[14] D.M.Guo, M.Zhang, Z.J.Jin and R.K.Kang: J. Mater. Sci. Technol., 2006, 22(4), 514.
[15] Z.J.Jin, M.Zhang, D.M.Guo and R.K.Kang: Key Eng. Mater., 2005, 291-292, 537.
[16] S.Kang, J-S.Yang and D.N.Lee: Plat. Surf. Finish., 1995, 82(10), 67.
[17] A.Damjanovic, T.H.Setty and J.O'M Bockris: J. Electrochem. Soc., 1966, 113, 429.
[18] G.C.Ye and D.N.Lee: Plat. Surf. Finish., 1981, 68(4), 60.
[19] D.N.Lee and G.C.Ye: Plat. Surf. Finish., 1981, 68(11), 46.
[20] C.Jiang, T.Goto and T.Hirai: J. Mater. Sci., 1994, 29, 669.
[21] Q.Wu and D.Barkey: J. Electrocbem. Soc., 2000, 147(3), 1038.
[22] E.J.Podlaha and D.Landolt: J. Electrocbem. Soc., 1997, 144(7), L200.
[23] P.Webb and N.Robertson: J. Electrocbem. Soc., 1994, 141(3), 669.
[24] J.L.Stojak and J.B.Talbot: J. Appl. Electrocbem., 2001, 31, 559.Q