J. Mater. Sci. Technol. ›› 2021, Vol. 95: 29-39.DOI: 10.1016/j.jmst.2021.03.065
• Research Article • Previous Articles Next Articles
Yuanyuan Qiaoa, Xiaoying Liua, Ning Zhaoa,*(
), Lawrence C M Wub, Chunying Liua, Haitao Maa
Received:2020-11-16
Accepted:2021-03-22
Published:2021-12-30
Online:2021-05-24
Contact:
Ning Zhao
About author:* E-mail address: zhaoning@dlut.edu.cn (N. Zhao).Yuanyuan Qiao, Xiaoying Liu, Ning Zhao, Lawrence C M Wu, Chunying Liu, Haitao Ma. Morphology and orientation evolution of Cu6Sn5 grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient[J]. J. Mater. Sci. Technol., 2021, 95: 29-39.
Fig. 1. Top-view SEM images of the as-reflowed Cu6Sn5 grains on (a) (001)Cu and (b) (011)Cu; cross-sectional SEM images and EBSD maps in RD of the Cu6Sn5 grains on (c,e) (001)Cu and (d,f) (011)Cu after isothermal reflow for 10 min, respectively.
Fig. 2. Microstructure of the (001)Cu/Sn/Cu micro solder joint reflowed under TG for 15 min: (a) cross-sectional SEM image, (b) phase map, (c) inverse pole figure of the Cu6Sn5 IMC in RD, (d)-(f) EBSD orientation maps in RD, TD and ND, respectively.
Fig. 3. Microstructure of the (001)Cu/Sn/Cu micro solder joint reflowed under TG for 60 min: (a) cross-sectional SEM image, (b) phase map, (c) inverse pole figure of the Cu6Sn5 IMC in RD, (d)-(f) EBSD orientation maps in RD, TD and ND, respectively.
Fig. 4. Microstructure of the fully IMC joint by reflowing a (001)Cu/Sn/Cu micro solder joint under TG for 120 min: (a) cross-sectional SEM image, (b) phase map, (c) inverse pole figure of the Cu6Sn5 IMC in RD, (d)-(f) EBSD orientation maps in RD, TD and ND, respectively.
Fig. 5. Microstructure of the (011)Cu/Sn/Cu micro solder joint reflowed under TG for 15 min: (a) cross-sectional SEM image, (b) phase map, (c) inverse pole figure of the Cu6Sn5 IMC in RD, (d)-(f) EBSD orientation maps in RD, TD and ND, respectively.
| Condition | 15 min | 60 min | 120 min | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Grain No. | 1# | 2# | 3# | 1# | 2# | 3# | 1# | 2# | 3# |
| θ angle (o) | 31.2 | 31.6 | 68.9 | 30.0 | 31.8 | 71.3 | 29.6 | 31.7 | 71.9 |
Table 1 Values of θ angle in the (011)Cu/Sn/Cu micro solder joints.
| Condition | 15 min | 60 min | 120 min | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Grain No. | 1# | 2# | 3# | 1# | 2# | 3# | 1# | 2# | 3# |
| θ angle (o) | 31.2 | 31.6 | 68.9 | 30.0 | 31.8 | 71.3 | 29.6 | 31.7 | 71.9 |
Fig. 6. Microstructure of the (011)Cu/Sn/Cu micro solder joint reflowed under TG for 60 min: (a) cross-sectional SEM image, (b) phase map, (c) inverse pole figure of the Cu6Sn5 IMC in RD, (d)-(f) EBSD orientation maps in RD, TD and ND, respectively.
Fig. 7. Microstructure of the (011)Cu/Sn/Cu micro solder joint reflowed under TG for 120 min: (a) cross-sectional SEM image, (b) phase map, (c) inverse pole figure of the Cu6Sn5 IMC in RD, (d)-(f) EBSD orientation maps in RD, TD and ND, respectively.
Fig. 8. Thickness of the interfacial Cu6Sn5 IMC as a function of reflow time under TG: (a) h-t; (b) logh-logt.
Fig. 9. Pole figures of the Cu6Sn5 grains and the (001)Cu in Fig. 2 after reflowed under TG for 15 min.
Fig. 10. Misorientation distribution of the Cu6Sn5 grain boundary in the (001)Cu/Sn/Cu micro solder joints after reflowed under TG for (a) 15 min, (b) 60 min, (c) 120 min.
Fig. 11. Pole figures of the Cu6Sn5 grains and the (011)Cu in Fig. 5 after reflowed under TG for 15 min.
Fig. 12. Pole figures of the Cu6Sn5 grains and the (011)Cu in Fig. 6 after reflowed under TG for 60 min: (a) {0001} pole figure of Cu6Sn5, (b) $\{10\bar{1}0\}$ pole figure of Cu6Sn5, (c) summary of the poles of {110}Cu pole figure.
Fig. 13. {0001} pole figures of Cu6Sn5 grains formed on the (011)Cu after reflowed under TG for (a) 15 min, (b) 60 min, (c) 120 min.
Fig. 14. Misorientation distributions of Cu6Sn5 grain boundary in the (011)Cu/Sn/Cu micro solder joints under TG for (a) 15 min, (b) 60 min, (c) 120 min.
Fig. 15. Schematics of morphology evolution of the Cu6Sn5 grains on the (001)Cu during reflow under TG: (a) as-reflowed, (b) 5 min, (c) 8 min, (d) 15 min.
Fig. 16. Schematics of the adjacent grains with different placement rules on (001)Cu: (a) perpendicular pair, (b) parallel pair.
Fig. 17. Schematics of the adjacent grains with different placement rules on (011)Cu: perpendicular pair in section A and parallel pair in section B.
Fig. 18. Schematic diagram of the Cu6Sn5 grains reflowed on different Cu substrates under different conditions: (a, b) isothermal reflow, (c, d) reflowed under TG.
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