Microstructure and brazing mechanism of porous Si3N4/Invar joint brazed with Ag-Cu-Ti/Cu/Ag-Cu multi-layered filler

doi:10.1016/j.jmst.2017.07.001

Abstract

Abstract:

Porous Si₃N₄ was brazed to Invar alloy in this study, and Ag-Cu-Ti/Cu/Ag-Cu multi-layered filler was designed to inhibit the formation of Fe₂Ti and Ni₃Ti intermetallic compounds. The effects of the brazing temperature and the thickness of Cu interlayer on the microstructure and mechanical properties of brazed joints were investigated. The typical microstructure of the joint brazed with multi-layered filler was porous Si₃N₄/TiN + Ti₅Si₃/Ag-Cu eutectic/Cu/Ag-Cu eutectic/Cu-rich layer + diffusion layer/Invar. When the brazing temperature increased, the reaction layer at the ceramic/filler interface grew thicker and the Cu interlayer turned thinner. As the thickness of Cu interlayer increased from 50 to 150 μm, the joint strength first increased and then decreased. In this research, the maximum shear strength (73 MPa) was obtained when being brazed at 1173 K with a 100 μm Cu interlayer applied in the filler, which was 55% higher than that brazed with single Ag-Cu-Ti brazing alloy and had reached 86% of the ceramic. The release of residual stress and the barrier effect of Cu interlayer to inhibit the formation of Fe₂Ti and Ni₃Ti intermetallics played the major role in the improvement of joint strength.

Key words: Porous Si₃N₄, Invar alloy, Brazing, Microstructure, Mechanical properties

fillerJ. Zhang, J.Y. Liu, T.P. Wang. Microstructure and brazing mechanism of porous Si₃N₄/Invar joint brazed with Ag-Cu-Ti/Cu/Ag-Cu multi-layered filler[J]. J. Mater. Sci. Technol., 2018, 34(4): 713-719.

Figures/Tables 10

Fig. 1. Microstructure of porous Si3N4.

Fig. 2. Schematic of the shear strength test.

Fig. 3. Microstructure of the joint brazed at 1173 K for 20 min: (a-c) Ag-Cu-Ti brazing filler, (d-f) Ag-Cu-Ti/Cu (100 μm)/Ag-Cu multi-layered filler.

Table 1 EDS results for various points marked in Fig. 3.

Position	Composition (at.%)						Possible phase
	Ag	Cu	Ti	Si	Fe	Ni
A	12.3	11.2	28	48.5	-	-	Si₃N₄, TiN
B	93.2	6.8	-	-	-	-	Ag[Cu]
C	5.1	93.8	-	-	-	1.1	Cu[Ag]
D	-	6.3	28.3	-	8.5	56.9	Ni-Ti
E	0.6	-	34.9	-	57.2	7.3	Fe-Ti
F	1.7	40.2	-	-	45.7	12.4	Fe-Ni[Cu]

Fig. 4. XRD pattern of different position in the joint brazed with Ag-Cu-Ti at 1173 K for 20 min.

Fig. 5. Images of porous Si3N4/Ag-Cu-Ti/Cu (100 μm)/Ag-Cu/Invar joint brazed at 1173 K for 20 min: (a) microstructure, (b-f) elements area distribution images.

Fig. 6. Microstructure of porous Si3N4/Invar joint brazed at 1123 K for 20 min with different thicknesses of Cu interlayer: (a) 50 μm, (b) 100 μm, (c) 150 μm.

Fig. 7. Microstructure of porous Si3N4/Invar joint brazed at different temperatures for 20 min with the thickness of Cu interlayer 100 μm: (a) 1123 K, (b) 1173 K, (c) 1223 K.

Fig. 8. Shear strength of porous Si3N4/Invar joint brazed with different Cu-foil thicknesses and different brazing temperatures.

Fig. 9. Fracture surface of porous Si3N4/Invar joint brazed at 1173 K for 20 min with different Cu interlayer thickness: (a) 50 μm Cu interlayer, (b) magnified photograph in (a); (c) 100 μm Cu interlayer, (d) magnified photograph in (c), (e, f) magnified photograph in (d).

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Microstructure and brazing mechanism of porous Si₃N₄/Invar joint brazed with Ag-Cu-Ti/Cu/Ag-Cu multi-layered filler

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