J. Mater. Sci. Technol. ›› 2022, Vol. 120: 167-171.DOI: 10.1016/j.jmst.2021.11.066

• Letter • Previous Articles     Next Articles

Integrating thin wall into block: A new scanning strategy for laser powder bed fusion of dense tungsten

Zhengang Xionga,b, Ji Zoua,*(), Zhaoyang Dengb, Jinhan Chenc, Wei Liuc, Yuchi Fanb, Minshi Wangd, Xiaoqing Zhaoa, Chunfeng Yub, Dongdong Dongb,*, Wenyou Mab,*(), Weimin Wanga, Zhengyi Fua   

  1. aState Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070,China
    bInstitute of New Materials, Guangdong Academy of Sciences,Guangzhou 510650, China
    cSchool of Materials Science and Engineering, Tsinghua University,Beijing 100084, China
    dSchool of Metallurgy and Materials, University of Birmingham,Birmingham B15 2TT, United Kingdom
  • Revised:2021-11-24 Published:2022-09-01 Online:2022-08-30
  • Contact: Ji Zou,Dongdong Dong,Wenyou Ma
  • About author:mawenyou@gdinm.com (W. Ma)
    * E-mail addresses: ji.zou@whut.edu.cn (J. Zou),

Abstract:

By integrating thin-wall into block (ITWB), a novel scanning strategy to manufacture dense tungsten with few cracks was developed in this study using laser powder bed fusion (LPBF). Different from the S-shaped grains observed from the other LPBFed tungsten, samples fabricated by the ITWB strategy present a pore-free microstructure composed of stacked columnar grains. The thermal conductivities of tungsten parts manufactured by the different strategies were compared. Although their temperature dependence was similar, phonon contribution to the total thermal conductivity varied significantly, which could be primarily interpreted by the differences on the grain boundary thermal resistance.

Key words: Laser powder bed fusion, Tungsten, Scanning strategy, Electrical property, Thermal property