Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density

J Mater Sci Technol ›› 2012, Vol. 28 ›› Issue (1): 46-52.

• Novel Processing and Characterization Methods • Previous Articles Next Articles

Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density

Hongwen He, Haiyan Zhao, Fu Guo, Guangchen Xu

1) Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
2) College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

Received:2010-06-08 Revised:2010-09-06 Online:2012-01-30 Published:2012-01-19
Contact: Hongwen He
Supported by:
the China Postdoctoral Science Foundation (No. 20100480250), the Beijing Natural Science Foundation Program and Scientific Research Key
Program of Beijing Municipal Commission of Education (No. KZ200910005004)

Abstract

Abstract: Bi layer formation in Cu/Sn{58Bi/Cu solder joints was investigated with different current densities and solder thickness. Uniform and continuous Bi layers were formed at the anode interface which indicated that Bi was the main diffusing species migrating from the cathode to the anode. The electromigration force and Joule heating took on the main driving forces for Bi diffusion and migration. In addition, two appearance types of Bi layers, planar-type and groove-type, were found during current stressing. The morphology and thickness of Bi layers were affected by current density and current stressing time.

Key words: Bi layer formation, Current density, Electromigration, Joule heating

Hongwen He, Haiyan Zhao, Fu Guo, Guangchen Xu. Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density[J]. J Mater Sci Technol, 2012, 28(1): 46-52.

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Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density

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