[1] R. Ishikawa, R. Mishra, A.R. Lupini, S.D. Findlay, T. Taniguchi, S.T. Pantelides, S.J. Pennycook Phys. Rev. Lett, 113 (2014), p. 155501 [2] P. Liu, W. Xing, X. Cheng, D. Li, Y. Li, X.-Q. Chen Phys. Rev. B, 90 (2014), p. 024103 [3] N. Hall, J.H. Racette J. Appl. Phys, 35 (1964), pp. 379-397 [4] J. Ma, S.H. Wei Phys. Rev. Lett, 110 (2013), p. 235901 [5] H.L. Liu, X. Shi, F.F. Xu, L.L. Zhang, W.Q. Zhang, L.D. Chen, Q. Li, C. Uher, T. Day, G.J. Snyder Nat. Mater, 11 (2012), pp. 422-425 [6] K.J. Puttlitz K.J. Puttlitz, K.A. Stalter (Eds.), Handbook of Lead-free Solder Technology for Microelectronic Assemblies, Marcel Dekker, Inc., New York (2004), pp. 239-280 [7] P.S. Ho, T. Kwok Rep. Prog. Phys, 52 (1989), pp. 301-348 [8] K.N. Tu J. Appl. Phys, 94 (2003), pp. 5451-5473 [9] C.Y. Liu, C. Chen, K.N. Tu J. Appl. Phys, 88 (2000), pp. 5703-5709 [10] Y.C. Hu, Y.H. Lin, C.R. Kao, K.N. Tu J. Mater. Res, 18 (2003), pp. 2544-2548 [11] Y.T. Yeh, C.K. Chou, Y.C. Hsu, C. Chen, K.N. Tu Appl. Phys. Lett, 86 (2005), p. 203504 [12] B. Chao, S.H. Chae, X. Zhang, K.H. Lu, J. Im, P.S. Ho Acta Mater, 55 (2007), pp. 2805-2814 [13] S.H. Chae, X. Zhang, K.H. Lu, H.L. Chao, P.S. Ho, M. Ding, P. Su, T. Uehling, L.N. Ramanathan J. Mater. Sci. Mater. Electron, 18 (2006), pp. 247-258 [14] T.L. Shao, Y.H. Chen, S.H. Chiu, C. Chen J. Appl. Phys, 96 (2004), pp. 4518-4524 [15] L.T. Chen, C.M. Chen J. Mater. Res, 21 (2011), pp. 962-969 [16] T.Y. Lee, K.N. Tu, D.R. Frear J. Appl. Phys, 90 (2001), pp. 4502-4508 [17] J.D. Wu, W. Lee, Y. Wu, S. Li Proceedings of the 42nd Annual International Reliability Physics Symposium, Phoenix IEEE, New York (2004), pp. 565-566 [18] H.B. Huntington, A.R. Grone J. Phys. Chem. Solids, 20 (1961), pp. 76-87 [19] J.P. Dekker, P. Gumbsch, E. Arzt Phys. Rev. B, 59 (1999), pp. 7451-7457 [20] P. Hohenberg, W. Kohn Phys. Rev, 136 (1964), pp. B864-B871 [21] W. Kohn, L.J. Sham Phys. Rev, 140 (1965), pp. A1133-A1138 [22] G. Kresse, J. Hafner Phys. Rev. B, 47 (1993), pp. 558-561 [23] G. Kresse, J. Furthmuller Phys. Rev. B, 54 (1996), pp. 11169-11186 [24] P.E. Blöchl Phys. Rev. B, 50 (1994), pp. 17953-17979 [25] J.P. Perdew, K. Burke, M. Ernzerhof Phys. Rev. Lett, 77 (1996), pp. 3865-3868 [26] H.J. Monkhorst, J.D. Pack Phys. Rev. B, 13 (1976), pp. 5188-5192 [27] D. Sheppard, P. Xiao, W. Chemelewski, D.D. Johnson, G. Henkelman J. Chem. Phys, 136 (2012), p. 074103 [28] S. Nosé J. Chem. Phys, 81 (1984), pp. 511-519 [29] H. Mehrer Diffusion in Solids: Fundamentals, Methods, Materials, Diffusion-controlled Processes Springer, Germany (2007), pp. 58-60 [30] J.F. Nicholas Acta Metall, 3 (1955), pp. 178-181 [31] J. Miller, D. Gemmell, R. Holland, J. Poizat, J. Worthington, R. Loess Phys. Rev. B, 11 (1975), pp. 990-994 [32] G. Hägg Z. Phys. Chem, 8 (1930), pp. 455-474 [33] B.F. Dyson, T.R. Anthony, D. Turnbull Bull. Am. Phys. Soc, 10 (1965), p. 1094 [34] B.F. Dyson, T.R. Anthony, D. Turnbull J. Appl. Phys, 37 (1966), pp. 2370-2374 [35] F. Frank, D. Turnbull Phys. Rev, 104 (1956), pp. 617-618 [36] T.R. Anthony, D. Turnbull Phys. Rev, 151 (1966), pp. 495-498 [37] M. Dariel, L. Kornblit, B. Beaudry, K. Gschneidner Phys. Rev. B, 20 (1979), pp. 3949-3956 [38] T.R. Anthony, D. Turnbull Appl. Phys. Lett, 8 (1966), pp. 120-121 [39] C.W. Mao Phys. Rev. B, 5 (1972), pp. 4693-4704 [40] B.F. Dyson J. Appl. Phys, 37 (1966), pp. 2375-2377 [41] B.F. Dyson J. Appl. Phys, 38 (1967), pp. 3408-3409 [42] F. Huang, H. Huntington Phys. Rev. B, 9 (1974), pp. 1479-1488 [43] C. Coston, N.H. Nachtrieb J. Phys. Chem, 68 (1964), pp. 2219-2229 [44] N.L. Peterson, F. Seitz, D. Turnbull, H. Ehrenreich (Eds.), Solid State Physics, vol. 22, Academic Press, New York (1968), pp. 409-512 [45] M.B. Dutt, B.L. Sharma Diffusion in Semiconductors Non-metallic Solids Springer-Verlag, Berlin (2003), pp. 334-335 [46] D. Berger, W. Lange Phys. Status Solidi (B), 18 (1966), pp. 67-74 [47] A. Ascoli, G. Poletti Phys. Rev. B, 6 (1972), pp. 3681-3684 [48] A.D. Le Claire Acta Metall, 1 (1953), pp. 438-447 [49] M. Mouas, J.G. Gasser, S. Hellal, B. Grosdidier, A. Makradi, S. Belouettar EPJ Web Conf, 15 (2011), p. 01013 [50] C. Yu, H. Lu J. Appl. Phys, 102 (2007), p. 054904 [51] M.S. Sellers, A.J. Schultz, C. Basaran, D.A. Kofke J. Appl. Phys, 110 (2011), p. 013528 |