[1] M.L. Huang, S.M. Zhou, L.D. Chen, J. Electron. Mater. 41 (2012) 730e740. [2] C. Chen, H.M. Tong, K.N. Tu, Annu. Rev. Mater. Res. 40 (2010) 531e555. [3] M.L. Huang, S. Ye, N. Zhao, J. Mater. Res. 26 (2011) 3009e3019. [4] Y.C. Hu, Y.H. Lin, C.R. Kao, K.N. Tu, J. Mater. Res. 18 (2003) 2544e2548. [5] Y.H. Lin, Y.C. Hu, C.M. Tsai, C.R. Kao, K.N. Tu, Acta Mater. 53 (2005) 2029e2035. [6] J.R. Cahoon, Metall. Mater. Trans. A 28 (1997) 583e593. [7] M.L. Huang, Z.J. Zhang, N. Zhao, Q. Zhou, Scripta Mater. 68 (2013) 853e856. [8] M.L. Huang, Q. Zhou, N. Zhao, Z. Zhang, J. Electron. Mater. 42 (2013) 2975e2982. [9] M.L. Huang, Q. Zhou, N. Zhao, X.Y. Liu, Z.J. Zhang, J. Mater. Sci. 49 (2014) 1755e1763. [10] X. Gu, Y.C. Chan, J. Electron. Mater. 37 (2008) 1721e1726. [11] C.N. Liao, C.P. Chung, W.T. Chen, J. Mater. Res. 20 (2005) 3425e 3429. [12] J.R. Huang, C.M. Tsai, Y.W. Lin, C.R. Kao, J. Mater. Res. 23 (2008) 250e257. [13] S.J. Wang, C.Y. Liu, J. Electron. Mater. 35 (2006) 1955e1960. [14] K.K. Hong, J.R. Ryu, C.Y. Park, J.Y. Huh, J. Electron. Mater. 37 (2008) 61e72. [15] W.H. Wu, H.L. Chung, C.N. Chen, C.E. Ho, J. Electron. Mater. 38 (2009) 2563e2572. [16] L.D. Chen, M.L. Huang, S.M. Zhou, J. Alloy. Compd 504 (2010) 535e541. [17] S.C. Hsu, S.J. Wang, C.Y. Liu, J. Electron. Mater. 32 (2003) 1214e 1221. [18] W.T. Chen, C.E. Ho, C.R. Kao, J. Mater. Res. 17 (2002) 263e266. [19] K.N. Tu, in: Solder Joint Technology, Materials, Properties, and Reliability, Springer, Inc., New York, 2007, pp. 37e70. [20] H. Gan, K.N. Tu, J. Appl. Phys. 97 (2005) 063514. |