[1 ] D.W. Baudrand: Electroless Nickel Plating, ASM Handbook, Vol. 5, ASM International, Materials Park, OH, 1994, 290.
[2 ] Y.Z. Zhang and M. Yao: Trans. Inst. Metal Finish., 1999, 77(2), 78.
[3 ] R.R. Tummala, E.J. Rymaszeski and A.G. Klopfenstein: Microelectronics Packaging Handbook, Part 2, Chapman and Hall, London, 1997, Chapter 8.
[4 ] S.V.S. Tyagi, S.K. Barthwal, V.K. Tandon and S. Ray: Thin Solid Films, 1989, 169(2), 229.
[5 ] P.S. Kumar and P.K. Nair: J. Mater. Process. Technol., 1996, 56, 511.
[6 ] N.M. Martyak and K. Drake: J. Alloy. Compd., 2000, 312, 30.
[7 ] E.M. Ma, S.F. Luo and P.X. Li: Thin Solid Films, 1988, 166, 273.
[8 ] R.C. Agarwala and S. Ray: Z. Metallkd., 1989, 80(8), 556.
[9 ] K.H. Hur, J.H. Jeong and D.N. Lee: J. Mater. Sci., 1991, 26(8), 2037.
[10] K. Parker: Plat. Surf. Finish., 1981, 68(12), 71.
[11] A.W. Goldenstein, W. Rostoker and F. Schossberger: J. Electrochem. Soc., 1957, 104(2), 104.
[12] R. Narayan and M.N. Mungole: Metal Finish., 1985, 83(11), 55.
[13] M.H. Staia, E.J. Cadtillo, E.S. Puchi, B. Lewis and H.E. Hintermann: Surf. Coat. Technol., 1996, 86-87, 598.
[14] J.Y. Song and J. Yu: Thin Solid Films, 2002, 415, 167.
[15] R.S. Razavi, M. Salehi, M. Monirvaghe¯ and G.R. Gordani: J. Mater. Process. Technol., 2009, 69, 112.
[16] P.H. Tremmel: Finish. Equipment, 1985, 34, 602.
[17] Y. He, H. Fu, X. Li and W. Gao: Scripta Mater., 2008, 58, 504.
[18] L.S. Birks and H. Friedman: J. Appl. Phys., 1946, 17, 687.
[19] Z. Guo, K.G. Keong and W. Sha: J. Alloy. Compd., 2003, 358, 112.
[20] K.G. Keong, W. Sha and S. Malinov: J. Mater. Sci., 2002, 37, 4445.
[21] Z. Ping, Y. He, C. Gu and T. Zhang: Surf. Coat. Technol., 2008, 202, 6023. |