Two-stage Hall-Petch relationship in Cu with recrystallized structure

doi:10.1016/j.jmst.2019.12.023

Abstract

Abstract:

Although Cu was studied extensively, the Hall-Petch relationship was mainly reported in the coarse-grained regime. In this work, fully recrystallized Cu specimens with a wide grain size regime of 0.51-14.93 μm manifest a two-stage Hall-Petch relationship. There is a critical grain size of 3 μm that divides stages I and II where the Hall-Petch slope k value are quite different. The stage II is supposed to be validified down to 100 nm at least by comparing with a Cu-Ag alloy. The critical grain size varies in different materials systems, and the underline mechanisms are discussed based on the dislocation glide modes.

Key words: Cu, Yield strength, Hall-Petch relationship, Ultrafine grain, Recrystallization

Y.Z. Tian, Y.P. Ren, S. Gao, R.X. Zheng, J.H. Wang, H.C. Pan, Z.F. Zhang, N.T suji, G.W. Qin. Two-stage Hall-Petch relationship in Cu with recrystallized structure[J]. J. Mater. Sci. Technol., 2020, 48: 31-35.

Figures/Tables 4

Fig. 1. (a, b) Backscattered images of pure Cu with representative grain sizes, (c) TEM image of the recrystallized Cu7Ag alloy with mean grain size of 177 nm and (d) HRTEM image from the grain interior of the recrystallized Cu7Ag alloy.

Fig. 2. Tensile engineering stress-strain curves of pure Cu processed by (a) cold rolling and annealing, (b) HPT and annealing [17] and (c) tensile engineering stress-strain curves of Cu7Ag alloy processed by HPT and annealing [14].

Fig. 3. Plots of yield strength against the inverse square root of grain size for pure Cu and Cu7Ag alloy. The reported Hall-Petch relationship is indicated by the broken line.

Fig. 4. (a) Plot of Hall-Petch slope against (Gb)1/2 for Cu, Al [7], Ni60Co40 alloy [20], CoCrNi alloy [20] and IF steel [21,22] and (b) Plot of critical grain size dc against γ /(Gb) for Cu, Al [7], Ni60Co40 alloy [20] and CoCrNi alloy [20]. dc is related to the transition from stage I to II Hall-Petch relationship.

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