Profiling interfacial reaction features between diamond and Cu-Sn-Ti active filler metal brazed at 1223 K

doi:10.1016/j.jmst.2022.05.032

Abstract

Abstract:

Diamond/Cu-Sn-Ti composites have been successfully prepared by cold-press forming in conjunction with high-temperature vacuum active brazing at 1223 K. Ensuing wetting behaviors between diamond and filler metal, interfacial characteristics of the reaction layer, and wear resistance of the bulky composite have been fully investigated. It is revealed that all diamond particles can only be fully coated when the TiH₂ content exceeds 5 wt%, below which sharp edges on diamond can still be observed. The interfacial reaction layer is found to be composed of TiC, the thickness of which is demonstrated to increase as a function of TiH₂ content, arriving at the peak value of 1.70 µm and remaining almost constant afterwards. It is further shown that the maximum wear resistance occurs approaching 5 wt% TiH₂ content. Potential mechanisms responsible for such interesting phenomena have been postulated.

Key words: Diamond, Cu-Sn-Ti, Brazing, Interfacial layer, Powder metallurgy

Yonggang Fan, Kenan Li, Haodong Li, Cong Wang. Profiling interfacial reaction features between diamond and Cu-Sn-Ti active filler metal brazed at 1223 K[J]. J. Mater. Sci. Technol., 2022, 131: 100-105.

Figures/Tables 6

Fig. 1. Typical wetting morphologies of diamond particles brazed by Cu-Sn-Ti filler metal with different TiH2 contents at 1223 K for 30 min. (a) Virgin diamond particles, (b) 1 wt%, (c) 3 wt%, (d) 5 wt%, (e) 7 wt%, and (f) 9 wt%. Red dashed lines areas show completely uncoated diamond particles, yellow dashed lines show partially coated diamond particles, and green dashed lines represent completely coated ones.

Fig. 2. XRD analyses of diamond/Cu-Sn-Ti composites brazed with different TiH2 contents: (a) 1 wt%, (b) 3 wt%, (c) 5 wt%, (d) 7 wt%, and (e) 9 wt%.

Fig. 3. Typical interfacial microstructures and EDS elemental mapping images of diamond/Cu-Sn-Ti composites with different TiH2 contents (1223 k, t = 30 min). (a) 1 wt%, (b) magnified region from (a), (c) elemental mappings of the magnified region by yellow square in (b); (d) 3 wt%, (e) magnified image of (d), (f) elemental mappings of the magnified region by yellow square in (e); (g) 5 wt%, (h) magnified image of (g), (i) elemental mappings of the magnified region by yellow square in (h); (j) 7 wt%, (k) magnified image of (j), (l) elemental mappings of the magnified region by yellow square in (k); (m) 9 wt%, (n) magnified image of (m), (o) elemental mappings of the magnified region by yellow square in (n); Green, blue, cyan and red squares represent areas where Cu, Sn, C and Ti exists, respectively. The average thickness of reaction layer was determined by EDS at the interface using the technique demonstrated by the present authors elsewhere [19].

Fig. 4. Variations of interfacial reaction layer thickness with different TiH2 content.

Fig. 5. Porosity and weight loss of diamond/Cu-Sn-Ti composites as a function of TiH2 content.

Fig. 6. Typical morphologies of the specimens after wear test of diamond/Cu-Sn-Ti composites treated with different TiH2 contents: (a) 1 wt%, (b) 3 wt%, (c) 5 wt%, (d) 7 wt%, and (e) 9 wt%. Red, green and blue dashed lines circle areas represent pull out, wear and crush of diamond particles, respectively. Yellow dashed lines are cracks in the metal matrix.

References 47

[1]	W. Zhang, Y. Zhong, C. Wang, J. Mater. Sci. Technol. 28 (2012) 661-665. DOI URL
[2]	S. Liu, L. Han, Y. Zou, P. Zhu, B. Liu, J. Mater. Sci. Technol. 33 (2017) 1386-1391. DOI URL
[3]	W.C. Li, C. Liang, S.T. Lin, Diam Relat. Mater. 11 (2002) 1366-1373. DOI URL
[4]	T.W. Hwang, C.J. Evans, E.P. Whitenton, S. Malkin, J. Manuf. Sci. Eng. 122 (2000) 42-50. DOI URL
[5]	M.W. Cook, P.K. Bossom, Int. J. Refract. Met. Hard Mater. 18 (2000) 147-152. DOI URL
[6]	J. Tamaki, A. Kubo, J.W. Yan, K. Narita, Key Eng. Mater. 238 (2003) 327-332.
[7]	J. Zhang, J.Y. Liu, T.P. Wang, J. Mater. Sci. Technol. 34 (2017) 139-145.
[8]	B. Chen, W.J. Zou, W.W. Li, S.B. Wu, H.P. Xiong, X. Wu, J. Mater. Sci. Technol. 50 (2020) 13-20. DOI
[9]	Y.T. Yan, J.H. Lin, T. Liu, B.S. Liu, B. Wang, L. Qiao, J.C. Tu, J. Cao, J.L. Qi, Corros. Sci. 200 (2022) 110231.
[10]	Y.T. Yan, T. Liu, J.H. Lin, L. Qiao, B.S. Liu, J.C. Tu, J. Cao, J.L. Qi, J. Alloy. Compd. 883 (2021) 160933.
[11]	Z.W. Yang, C.L. Wang, Y. Wang, L.X. Zhang, D.P. Wang, J.C. Feng, J. Mater. Sci. Technol. 33 (2017) 1392-1401. DOI
[12]	Y. Wang, K. Lei, Y. Ruan, W. Dong, Int. J. Refract. Met. Hard Mater. 54 (2016) 98-103. DOI URL
[13]	W.F. Ding, J.H. Xu, Z.Z. Chen, Q. Miao, C.Y. Yang, Mater. Sci. Eng. A 559 (2013) 629-634. DOI URL
[14]	Y.G. Fan, J.X. Fan, C. Wang, J. Mater. Sci. Technol. 68 (2020) 35-39. DOI URL
[15]	Q.Y. Zhai, Y. Yang, J.F. Xu, X.F. Guo, Chin. J. Nonferrous. Met. 16 (2006) 1374-1379. DOI URL
[16]	S. Liu, B. Xiao, H. Xiao, L. Meng, Z. Zhang, H. Wu, Surf. Coat. Technol. 286 (2016) 376-382. DOI URL
[17]	Y. Wang, X.M. Qiu, D.Q. Sun, S.Q. Yin, Int. J. Refract. Met. Hard Mater. 29 (2011) 293-297. DOI URL
[18]	W.F. Ding, J.H. Xu, M. Shen, Y.C. Fu, B. Xiao, Int. J. Refract. Met. Hard Mater. 24 (2006) 432-436. DOI URL
[19]	Y.G. Fan, J.X. Fan, C. Wang, J. Mater. Sci. Technol. 35 (2019) 2163-2168. DOI URL
[20]	Y.C. Hsieh, S.T. Lin, J. Alloy. Compd. 466 (2008) 126-132. DOI URL
[21]	Y.V. Naidich, V.S. Zhuravlev, I.I. Gab, B.D. Kostyuk, V.P. Krasovskyy, A.A. Adamovskyy, N.Y. Taranets, J. Eur. Ceram. Soc. 28 (2008) 717-728. DOI URL
[22]	C. Leinenbach, R. Transchel, K. Gorgievski, F. Kuster, H.R. Elsener, K. Wegener, J. Mater. Eng. Perform. 24 (2015) 2042-2050. DOI URL
[23]	S. Scudino, C. Unterdörfer, K.G. Prashanth, H. Attar, N. Ellendt, V. Uhlenwinkel, J. Eckert, Mater. Lett. 156 (2015) 202-204. DOI URL
[24]	H.K. Shao, A.P. Wu, Y.D. Bao, Y. Zhao, G.S. Zou, L. Liu, Mater. Charact. 144 (2018) 469-478. DOI URL
[25]	G. Yang, X. Li, X. Han, H. Zhang, L. Wen, S. Li, Microelectron. Reliab. 130 (2022) 114481.
[26]	J. Wang, C. Liu, C. Leinenbach, U.E. Klotz, Calphad. 35 (2011) 82-94. DOI URL
[27]	W. Zhai, W.L. Wang, D.L. Geng, B. Wei, Acta Mater. 60 (2012) 6518-6527. DOI URL
[28]	F. Kohler, T. Campanella, S. Nakanishi, M. Rappaz, Acta Mater. 56 (2008) 1519-1528. DOI URL
[29]	H. Zhang, X. Li, P. Yao, L. Wen, Y. Zhu, X. He, G. Yang, Mater. Charact. 186 (2022) 111791.
[30]	X. Deng, N. Chawla, K.K. Chawla, M. Koopman, Acta Mater. 52 (2004) 4291-4303. DOI URL
[31]	P. Zhu, P. Wang, P. Shao, X. Lin, Z. Xiu, Q. Zhang, E. Kobayashi, G. Wu, J. Min. Met. Mater. 29 (2022) 200-211.
[32]	S. Dai, J. Li, N. Lu, Diam Relat. Mater. 108 (2020) 107993.
[33]	R.M. Nascimento, A.E. Martinelli, A.J.A. Buschinelli, Cerâmica 49 (2003) 178-198. DOI URL
[34]	P.C. Wang, Z.Q. Xu, X.F. Liu, H.H. Wang, B. Qin, J.H. Lin, J. Cao, J.L. Qi, J.C. Feng, Carbon 191 (2022) 290-300. DOI URL
[35]	L.Y. Xu, X. Chen, H.Y. Jing, L.X. Wang, J. Wei, T.D. Han, Mater. Sci. Eng. A 667 (2016) 87-96. DOI URL
[36]	F.A. Khalid, U.E. Klotz, H.R. Elsener, B. Zigerlig, P. Gasser, Scr. Mater. 50 (2004) 1139-1143. DOI URL
[37]	W.C. Li, S.T. Lin, C. Liang, Metall. Mater. Trans. A 33 (2002) 2163-2172. DOI URL
[38]	Y. Choi, S.W. Rhee, J. Mater. Sci. 30 (1995) 4637-4644. DOI URL
[39]	D.Z. Duan, B. Xiao, B. Wang, P. Han, W.J. Li, S.W. Xia, Int. J. Refract. Met. Hard Mater. 48 (2015) 427-432. DOI URL
[40]	U.E. Klotz, C. Liu, F.A. Khalid, H.R. Elsener, Mater. Sci. Eng. A 495 (2008) 265-270. DOI URL
[41]	S.F. Huang, H.L. Tsai, S.T. Lin, Mater. Chem. Phys. 84 (2004) 251-258. DOI URL
[42]	Q.L. Li, H.Z. Ren, W.N. Lei, K. Ding, L. Ding, S.R. Zhang, Int. J. Adv. Manuf. Tech. 95 (2017) 2111-2118. DOI URL
[43]	S.X. Liu, B. Xiao, Z.Y. Zhang, D.Z. Duan, Int. J. Refract. Met. Hard Mater. 54 (2016) 54-59. DOI URL
[44]	X. Liu, S. He, H. Nishikawa, Scr. Mater. 110 (2016) 101-104. DOI URL
[45]	A. Korneva, B. Straumal, A. Kilmametov, L. Lityńska-Dobrzyńska, G. Cios, P. Bała, P. Zięba, Mater. Charact. 118 (2016) 411-416. DOI URL
[46]	C.Y. Ma, W.F. Ding, J.H. Xu, Y.C. Fu, Mater. Des. 65 (2015) 50-56. DOI URL
[47]	B. Zhao, T. Yu, W. Ding, L. Zhang, H. Su, Z. Chen, Mater. Sci. Eng. A 730 (2018) 345-354. DOI URL