J. Mater. Sci. Technol. ›› 2021, Vol. 68: 16-29.DOI: 10.1016/j.jmst.2020.06.042
• Research Article • Previous Articles Next Articles
Yufang Zhao, Jinyu Zhang*(), YaQiang Wang, Shenghua Wu, Xiaoqing Liang, Kai Wu, Gang Liu, Jun Sun
Received:
2020-03-28
Revised:
2020-06-02
Accepted:
2020-06-18
Published:
2021-03-30
Online:
2021-05-01
Contact:
Jinyu Zhang
About author:
*E-mail address: jinyuzhang1002@mail.xjtu.edu.cn (J. Zhang).Yufang Zhao, Jinyu Zhang, YaQiang Wang, Shenghua Wu, Xiaoqing Liang, Kai Wu, Gang Liu, Jun Sun. The metastable constituent effects on size-dependent deformation behavior of nanolaminated micropillars: Cu/FeCoCrNi vs Cu/CuZr[J]. J. Mater. Sci. Technol., 2021, 68: 16-29.
Fig. 1. XRD patterns of the (a) Cu/HEA and (b) Cu/MG NLs with different layer thickness h, and corresponding curves of monolithic HEA and Amorphous CuZr are in the bottom.
Fig. 2. (a, b) Representative XTEM images of Cu/HEA NLs with h = 10 nm show the columnar grains with twins penetrating interfaces. (c, d) Typical XTEM images of Cu/HEA NLs with h = 100 nm show nanolayered structure with twins inside the nanograins. The corresponding SADPs inserted in (a, c) exhibit overlapping (111) and (200) textures.
h (nm) | Cu/HEA | Cu/MG | |||||
---|---|---|---|---|---|---|---|
Grain size d (nm) | Twin’s fraction PT (%) | dCu (nm) | |||||
dall | dCu | dHEA | PTall | PTCu | PTHEA | ||
5 | 28 ± 5 | - | - | 81 ± 5 | - | - | 4 ± 2 |
10 | 39 ± 6 | - | - | 82 ± 6 | - | - | 9 ± 3 |
20 | - | - | - | - | - | - | 18 ± 2 |
25 | 38 ± 6 | - | - | 79 ± 5 | - | - | - |
50 | - | 21 ± 4 | 9 ± 3 | - | 48 ± 5 | 100 | 31 ± 4 |
100 | - | 45 ± 5 | 10 ± 1 | - | 57 ± 5 | 100 | 48 ± 5 |
Table 1 Summary of the microstructure sizes in Cu/HEA C/CNLs and Cu/MG C/ANLs, including grain size d and twin’s fraction PT.
h (nm) | Cu/HEA | Cu/MG | |||||
---|---|---|---|---|---|---|---|
Grain size d (nm) | Twin’s fraction PT (%) | dCu (nm) | |||||
dall | dCu | dHEA | PTall | PTCu | PTHEA | ||
5 | 28 ± 5 | - | - | 81 ± 5 | - | - | 4 ± 2 |
10 | 39 ± 6 | - | - | 82 ± 6 | - | - | 9 ± 3 |
20 | - | - | - | - | - | - | 18 ± 2 |
25 | 38 ± 6 | - | - | 79 ± 5 | - | - | - |
50 | - | 21 ± 4 | 9 ± 3 | - | 48 ± 5 | 100 | 31 ± 4 |
100 | - | 45 ± 5 | 10 ± 1 | - | 57 ± 5 | 100 | 48 ± 5 |
Fig. 3. Typical XTEM images of Cu/MG NLs with different h, showing clearly modulated structure: (a, b) h = 5 nm and (c, d) h = 100 nm. The inserted FFT images in (b) manifest the crystalline structure of Cu layers and amorphous structure of CuZr layers.
Fig. 4. Typical XTEM images of ~ 20 % compressed Cu/HEA micropillars with D = 800 nm and (a-c) h = 10 nm, (d-f) h = 50 nm. The corresponding STEM images are inserted in (a), showing the lamellar structure. The origin dash line boxed region in (b) is the severe compressed region, in which the nanotwins are nearly absent manifesting detwinnig occurs. (c) The corresponding HRTEM image with FFT image inserted. The corresponding FFT image inserted in (e) manifests nanotwins in HEA are stable while detwinning also occurs in Cu layer. Interfaces are marked by the orange dash line. The change of plastic strain for each constituent layer is inserted in (f).
Fig. 5. (a) Cross-sectional image of the ~ 20 % deformed Cu/MG pillar (with the direction perpendicular to the top surface of the pillar), with the plastic strain of each layer inserted. (b) Cross-sectional SEM image of ~ 30 % compressed Cu/MG micropillar with h = 50 nm. (c-d) Typical XTEM images of ~ 30 % compressed Cu/MG micropillars with h =50 nm. FFT image inserted in (d) manifest the formation of crystalline CuZr. Interfaces are marked by the yellow dash line.
Fig. 7. Representative SEM images of Cu/HEA micropillars after 30 % strain in uniaxial compression test. (a) D = 500 nm micropillar with h = 10 nm shows shear deformation. (b) D =800 nm micropillar with h = 10 nm shows homogenous deformation. (c) D = 500 nm and (d) D = 800 nm micropillars with h = 50 nm, (e) D = 500 nm micropillar with h = 100 nm show shearing with extrusion of Cu layers and microcracks in HEA layers. (f) D = 800 nm micropillar with h =100 nm shows extrusion of Cu layers and microcracks in HEA layers. Corresponding SEM images of pillars before compression are inserted.
Fig. 8. Representative SEM images of Cu/MG micropillars after 15-30 % strain in uniaxial compression test. (a) D = 350 nm micropillar with h = 10 nm shows homogeneous shear deformation. (b) D = 700 nm micropillar with h = 10 nm shows in homogeneous shear deformation. (c) D = 350 nm and (d) D = 700 nm micropillars with h = 50 nm, (e) D = 525 nm and (f) D = 1050 nm micropillars with h =100 nm show barreling of the micropillars and extrusion of Cu layers. Corresponding SEM images of pillars before compression are inserted.
Fig. 9. Compressive true stress-strain curves for (a-c) Cu/HEA and (e-g) Cu/HEA micropillars with different pillar diameter D and layer thickness h. Stress increment Δσ as a function of h for (d) Cu/HEA and (h) Cu/MG, respectively.
Fig. 10. The stress of (a) Cu/HEA and (b) Cu/MG micropillars obtained from the true stress-strain curves of ~5 % strain offset as a function of diameter with different layer thickness h. (c) The power-law exponent n of Cu/HEA and Cu/MG micropillars as a function of h.
Fig. 12. (a) Deformation mode map for the Cu/HEA micropillars. Experimental observations are summarized with data symbols: localized shear banding (hollow square) in RI, homogeneous barreling deformation (solid circle) in RII, shear + extrusion and microcracks deformation (half diamond) in RIII and extrusion and microcracks deformation (solid trilateral) in RIV. (b) Deformation mode map for the Cu/MG micropillars. Experimental observations are summarized with data symbols: homogeneous shear deformation (half diamond) in RI, inhomogeneous shear deformation (hollow square) in RII and extrusion deformation (solid circle) in RIII.
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