J. Mater. Sci. Technol.

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Effect of Transverse Grain Boundary on Microstructure, Texture and Mechanical Properties of Drawn Copper Wires

Jian Chen, Xiaoguang Ma, Wen Yan, Feng Xia, Xinhui Fan   

  1. School of Mat Science and Chemical Engineering, Xi’an Technological University, Xi’an 710032, China
  • Received:2012-09-04 Revised:2012-11-04 Online:2014-02-15 Published:2014-02-14
  • Contact: W. Yan
  • Supported by:

    The National Natural Science Foundation of China (Nos. 51171135 and 50890171), and the Key Science and Technology Programof Shaanxi Province, China (No. 2012K07-08).

Abstract:

In the present study, microstructure and texture of drawn copper wires with a large number of transverse grain boundaries have been characterized and their mechanical properties have been analyzed. The results show that the texture evolution is accelerated by transverse grain boundary and the saturation value 60% of volume fraction of <111> fiber texture component is reached rapidly with increasing strain. For the microstructure of drawn wires with a large number of transverse grain boundaries, the critical strain, where lamellar boundaries form, is less than that for wires with equiaxed grains or columnar grains (all grain boundaries parallel to axis direction). Since transverse grain boundary accelerates grain subdivision and dislocation density increases rapidly in drawn wires with a large number of transverse grain boundaries, there are a higher flow stress and a higher work hardening rate.

Key words: Transverse grain boundary, Cold drawing, Texture, Microstructure, Ultimate tensile strength