Single crystal-single crystal bonding of langasite exhibited high strength of 23.28 MPa

doi:10.1016/j.jmst.2023.03.030

Abstract

Abstract: Langasite (LGS, La₃Ga₅SiO₁₄) is a promising material in high-temperature piezoelectric devices due to its excellent thermal stability, piezoelectricity, and electrical property. A major challenge in the development of LGS-based devices is to form high-strength bonding of the brittle LGS. Here, we report that the single crystal-single crystal (dual-SC) bonding of LGS is realized through thermal activation under a low compression of 50 kPa for the first time. A record bonding strength of 23.28 MPa is achieved within the dual-SC bonded LGS/LGS structure (with a high bonding ratio exceeding 93%), which is 5 times higher than that of the recent reported LGS/LGS bonding structure (in which a relatively fragile amorphous interface layer is formed between the two LGS samples). The smooth and void-free dual-SC bonding interface of LGS is verified via the cross-sectional transmission electron microscopy (TEM) observations.

Key words: Thermal activation, Single crystal-single crystal bonding, Langasite, High-strength, Low compression

Guangyao Pei, Binghe Ma, Tao Ye, Zhonggang Zhang, Keli Zhao, Jinjun Deng, Seeram Ramakrishna, Jian Luo. Single crystal-single crystal bonding of langasite exhibited high strength of 23.28 MPa[J]. J. Mater. Sci. Technol., 2023, 160: 139-147.

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