Hierarchical Ni-plated melamine sponge and MXene film synergistically supported phase change materials towards integrated shape stability, thermal management and electromagnetic interference shielding

doi:10.1016/j.jmst.2022.05.049

Abstract

Abstract:

Along with the integrated and miniaturized development of advanced electronic devices, phase change materials (PCMs) simultaneously with efficient thermal management and high electromagnetic interference (EMI) shielding effectiveness (SE) are ungently demanded. Herein, the shape-stabilized MXene/Ni-platted melamine sponge/Regenerated cellulose/Graphene nanoplate/Polyethylene glycol (MX/Ni@MS/RCG/PEG) composite PCMs comprising hierarchical Ni@MS/RCG and MXene film were fabricated via a facile encapsulation approach. Hierarchical Ni@MS/RCG hybrid aerogel was prepared by electroless plating and sol-gel methods, and MXene film was obtained using vacuum-assisted filtration procedure. The synergistic effect of conductive Ni@MS/RCG networks and tight MXene film endows MX/Ni@MS/RCG/PEG composite PCMs with good shape stability, high cyclic reliability, large latent heat of phase change (154.3 J g^-1), excellent thermal conductivity (TC, 0.47 W m^-1 K^-1) and favorable EMI shielding performance (32.7 dB). The TC of acceptable 0.47 W m^-1 K^-1 is observed for MX/Ni@MS/RCG-5/PEG at a rather low GNP content of merely 0.39 wt%. In addition, the temperature variation of MX/Ni@MS/RCG-5/PEG is a lot faster than that of pure PEG in the heating/cooling process, revealing the remarkable energy storage and release efficiency for the composite PCMs. This investigation has taken an important step towards shape-stabilized composite PCMs with both effective thermal management and high EMI SE for promising applications in electronic packaging and advanced energy.

Key words: Phase change material, Thermal management, Electromagnetic interference shielding, Shape stability, Encapsulation

Ziling Cheng, Guojun Chang, Bai Xue, Lan Xie, Qiang Zheng. Hierarchical Ni-plated melamine sponge and MXene film synergistically supported phase change materials towards integrated shape stability, thermal management and electromagnetic interference shielding[J]. J. Mater. Sci. Technol., 2023, 132: 132-143.

Figures/Tables 12

Fig. 1. Schematic diagram for the fabrication process of MX/Ni@MS/RCG-x/PEG composite PCMs.

Fig. 2. SEM images of (a) MS and (b, c) Ni@MS. EDS mapping images of (d) the scanning view and (e) Ni element of Ni@MS. XPS spectra of Ni@MS, (f) full-range spectrum, (g) high-resolution C 1s core level spectrum, (h) high-resolution Ni 2p core level spectrum, and (i) high-resolution N 1s core level spectrum.

Fig. 3. SEM images of (a) MAX powders and (b) etched multilayered MXene powders. (c) TEM image of exfoliated MXene nanosheets. (d) Optical image of MXene dispersion. (e) XRD patterns of MAX, multilayered MXene and exfoliated MXene. XPS survey spectra of exfoliated MXene, (f) the full-range spectrum, (g) XPS C 1s core level spectrum, (h) XPS O 1s core level spectrum, and (i) XPS Ti 2p core level spectrum.

Fig. 4. Cross-sectional SEM images of (a) Ni@MS/RCG-1 hybrid aerogel, (b) Ni@MS/RCG-3 hybrid aerogel, and (c) Ni@MS/RCG-5 hybrid aerogel. (a’-c’) the corresponding high-magnification SEM images in the rectangle of SEM images (a-c).

Fig. 5. Cross-sectional SEM images of (a, a′) Ni@MS/RCG-0/PEG, (b, b′) Ni@MS/RCG-1/PEG, (c, c′) Ni@MS/RCG-3/PEG, and (d, d′) Ni@MS/RCG-5/PEG. EDS mapping images of (e) the scanning view, (f) Ni element, (g) C element, and (h) O element of Ni@MS/RCG-5/PEG.

Fig. 6. Cross-sectional SEM images of (a, a’) MX/Ni@MS/RCG-0/PEG, (b, b’) MX/Ni@MS/RCG-1/PEG, and (c, c’) MX/Ni@MS/RCG-3/PEG.

Fig. 7. EDS mapping images of MX/Ni@MS/RCG-5/PEG: (a) the scanning view, (b) C element, (c) O element, (d) N element, (e) Ni element, and (f) Ti element.

Fig. 8. DSC curves of (a) heating and (b) cooling procedures of different samples. (c) DSC curves of Ni@MS/RCG-5/PEG after 50th thermal cycles. (d, e) Photographs of different samples on the hot stage of different temperatures.

Table 1. Representative thermal parameters of different samples obtained during DSC measurements.

Sample	T_m	T_c	ΔH_m	ΔH_c
Sample	(°C)	(°C)	(J g^-1)	(J g^-1)
PEG 6000	59.0	40. 9	157.3	155.7
MX/Ni@MS/RCG-0/PEG	66.4	35.7	148.8	146.8
MX/Ni@MS/RCG-1/PEG	64.6	34.3	139.3	136.8
MX/Ni@MS/RCG-3/PEG	66.2	33.6	150.0	137.9
MX/Ni@MS/RCG-5/PEG	63.0	38.9	154.3	150.3
MX/Ni@MS/RCG-5/PEG⁵⁰th	60.5	38.9	150.2	147.7

Fig. 9. (a) Comparison of thermal conductivities of Ni@MS/RCG/PEG and MX/Ni@MS/RCG/PEG composites. Infrared (IR) photographs of the representative PEG and MX/Ni@MS/RCG-5/PEG samples in the (b) heating and (c) cooling processes.

Fig. 10. (a) EMI SET, (b) average SER, SEA and SET, and (c) average A-R coefficients of Ni@MS/RCG/PEG PCMs with different GNP content in X-band; (d) EMI SET, (e) average SER, SEA and SET, and (f) average A-R coefficients of MX/Ni@MS/RCG/PEG PCMs with different GNP content in X-band.

Fig. 11. Comparison of EMI shielding properties (SET), thermal conductivities (TC) and latent heat retention rates (η) for different CPCMs [67], [68], [69], [70], [71], [72].

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