Construction of continuous heat conductive channel, a double harvest strategy to enhance thermal conductance and bending strength of C/SiC composites

doi:10.1016/j.jmst.2021.06.063

Abstract

Abstract:

The development of efficient and quick method to prepare structure-function integrative C/SiC composites is always a major challenge in this field. Herein, the thermal conductivity and bending strength of C/SiC composites were enhanced simultaneously via continuous high heat conductive channels constructed by continuous wave laser machining and pitch-based high thermal conductivity carbon fiber in thickness direction. Results revealed that the thermal conductivity of the modified C/SiC composites is three times higher than that of referential C/SiC composites due to its highly ordered heat conducive channel in the thickness direction. Importantly, the bending strength of modified C/SiC composites increased to 457 MPa. To better understand the enhance mechanism, the micro-structure for both the composites and heat conductive channel was systematically analyzed. The results demonstrated that the rivet effect of heat conductive channel and the formed two phases structure on the fibers dispersed partial of load and finally enhanced the property of the composites. In a word, this method holds a nice applicable future in constructing structure-function integrative C/SiC composites.

Key words: C/SiC composites, Structure-function integrative, Thermal conductivity, Bending strength, Heat conductive channel

Yunhai Zhang, Yongsheng Liu, Liyang Cao, Xutong Zheng, Yejie Cao, Jing Wang, Qing Zhang. Construction of continuous heat conductive channel, a double harvest strategy to enhance thermal conductance and bending strength of C/SiC composites[J]. J. Mater. Sci. Technol., 2022, 105: 101-108.

Figures/Tables 8

Fig. 1. Morphology of micro-channel: (a-c) morphology of micro-channel before washing, (d-f) morphology of micro-channel after washing.

Fig. 2. SEM images of HTCF-C/SiC composites: (a) surface of filled micro-channel, (b) high magnification image of HTC in micro-channel, (c) backscatter diffraction image of filled micro-channel, (d) the image of HTCF-C/SiC composites observed with Micro-CT (the color represents the closed pores volume and distribution within the composites) and (e) the local magnification image of Micro-CT (The white band along the Micro-channel is the SiC dense band).

Fig. 3. Thermal properties of HTCF-C/SiC composites: (a) thermal conductivity, (b) thermal diffusivity and (c) specific heat capacity.

Table 1. the density and bending strength of C/SiC and HTCF-C/SiC composites

Sample	Density (g/cm³)	Bending strength (MPa)
C/SiC	2.21	345.05 ± 28
HTCF-C/SiC	2.17	457.09 ± 21

Fig. 4. Fracture surface and fracture schematic diagram of three-point bending strength test: (a, c, e) C/SiC composites, (b, d, f) HTCF-C/SiC composites.

Fig. 5. Schematic diagram of bending deformation: (a) general bending deformation, (b) bending stress distribution of general bending deformation, (c) shear stress distribution corresponding to general C/SiC composites, (d) bending fracture of C/SiC composites, (e) bending fracture of HTCF-C/SiC composites.

Fig. 6. fracture morphology of HTCF: (a1-a4) the fracture morphology of single HTCF, (b1-b4) the fracture morphology of HTCF in HTCF-C/SiC composites, (c1-c4) the fracture morphology of HTCF in HTCF-C/SiC composites with high magnification.

Fig. 7. EDS mapping of surface of HTCF: (a1, b1 and c1) the grey image of HTCF, (a2, b2 and c2) the distribution of carbon element, (a3, b3 and c3) the distribution of silicon element. (c1 is a polished surface.)

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