Reinforcement size effect on thermal conductivity in Cu-B/diamond composite

doi:10.1016/j.jmst.2021.03.018

Abstract

Abstract:

In the Cu/diamond composites modified by metal matrix alloying, the interfacial thermal conductance depends on the in-situ formed interfacial carbide layer that further depends on the diamond particle size. We fix boron alloying content as 0.3 wt% and vary diamond particle size from 66 to 701 µm to tune interfacial carbide layer with an attempt to separate the two dependences of diamond particle size and interfacial thermal conductance. The Cu-0.3 wt% B/diamond composite exhibits a slowing increase in thermal conductivity as the diamond particle size is larger than 300 µm because of a simultaneous decrease in the interfacial thermal conductance. A high thermal conductivity of 904 W/(m K) is obtained with diamond particle size of 701 μm. The findings emphasize the importance of tailoring interfacial carbide layer to attain high thermal conductivity in the Cu/diamond composites modified by metal matrix alloying.

Key words: Metal matrix composites, Thermal conductivity, Diamond particle size, Interface structure

Yongjian Zhang, Guangzhu Bai, Xiaoyan Liu, Jingjie Dai, Xitao Wang, Hailong Zhang. Reinforcement size effect on thermal conductivity in Cu-B/diamond composite[J]. J. Mater. Sci. Technol., 2021, 91: 1-4.

Figures/Tables 4

Fig. 1. Characterization of the diamond particles: (a) morphology, (b) particle size histogram of the 272 μm batch, and (c) surface-area-to-volume ratio.

Table 1 Characteristics of the diamond particles in the composites.

Average diameter (μm)	66	116	272	528	701
Nitrogen content (ppm)	220	130	130	220	200
Thermal conductivity (W/(m K))	1481	1775	1775	1481	1546
Diamond volume fraction (%)	64.6	66.2	68.3	68.0	68.7

Fig. 2. Microstructures of the Cu-B/diamond composite: (a) backscattered electron (BSE) image, secondary electron (SE) images of the extracted diamond particles with particle sizes of (b) 66 μm and (c) 701 μm, and (d) TEM image of the Cu-B/diamond interface. The inset displays the STEM annular bright field (ABF) image of the carbide/diamond interface.

Fig. 3. (a) Measured thermal conductivity and predicted thermal conductivity by the DEM model for the Cu-B/diamond composites reinforced with various diamond particle sizes, along with the corresponding interfacial thermal conductance; (b) Comparison of thermal conductivity with literature.

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