J. Mater. Sci. Technol. ›› 2020, Vol. 49: 7-14.DOI: 10.1016/j.jmst.2020.02.023
• Research Article • Previous Articles Next Articles
Lei Lei1, Yu Su1, Leandro Bolzoni, Fei Yang*()
Received:
2019-11-12
Revised:
2020-01-10
Accepted:
2020-01-12
Published:
2020-07-15
Online:
2020-07-17
Contact:
Fei Yang
About author:
1 Equal contribution.
Lei Lei, Yu Su, Leandro Bolzoni, Fei Yang. Evaluation on the interface characteristics, thermal conductivity, and annealing effect of a hot-forged Cu-Ti/diamond composite[J]. J. Mater. Sci. Technol., 2020, 49: 7-14.
Sample | Heating rate (℃/min) | Temperature (℃) | Holding time (h) | Cooling rate (℃/min) |
---|---|---|---|---|
Cu-Ti/Dia-1 | 30 | 800 | 1 | 5 |
Cu-Ti/Dia-2 | 5 | 800 | 2 | 5 |
Table 1 The heat treatment parameters for the encapsulated specimens.
Sample | Heating rate (℃/min) | Temperature (℃) | Holding time (h) | Cooling rate (℃/min) |
---|---|---|---|---|
Cu-Ti/Dia-1 | 30 | 800 | 1 | 5 |
Cu-Ti/Dia-2 | 5 | 800 | 2 | 5 |
Fig. 3. Surface morphology of the extracted diamond particles from the copper/diamond composites: (a-c) Cu-Ti/Dia-0, (d-f) Cu-Ti/Dia-1, (g-i) Cu-Ti/Dia-2.
Fig. 5. Interface characteristics of copper-Ti/diamond. (a) Representative TEM image; (b) and (c) HRTEM images recorded at the marked b and c regions in (a); (d), (e) and (f) HRTEM images recorded at the marked d, e, f regions in (b) and (c); and (g) HRTEM images recorded at the marked g region in (a).
Fig. 6. (a) Thermal conductivity and thermal diffusivity of hot-pressed Cu and Cu-Ti alloy, and Cu-Ti/Dia-0, Cu-Ti/Dia-1, and Cu-Ti/Dia-2 composites, (b) thermal conductivity comparison between current research and published papers.
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