Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding

doi:10.1016/j.jmst.2019.11.015

Abstract

Abstract:

As an advanced solid state bonding process, plastic deformation bonding (PDB) is a highly reliable metallurgical joining method that produces significant plastic deformation at the bonding interface of welded joints through thermo-mechanical coupling. In this study, PDB behavior of IN718 superalloy was systematically investigated by performing a series of isothermal compression tests at various processing conditions. It was revealed that new grains evolved in the bonding area through discontinuous dynamic recrystallization (DDRX) at 1000-1150 °C. Electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) results revealed that the bonding of joints is related with interfacial grain boundary (IGB) bulging process, which is considered as a nucleation process of DRXed grain under different deformation environments. During recrystallization process, the bonded interface moved due to strain-induced boundary migration (SIBM) process. Stored energy difference (caused by accumulation of dislocations at the bonding interface) was the dominant factor for SIBM during DRX. The mechanical properties of the bonded joints were dependent upon the recrystallized microstructure and SIBM ensued during PDB.

Key words: Isothermal compression bonding, Dynamic recrystallization, Microstructures, Grain boundary, Misorientation

Jian Yang Zhang, Bin Xu, Naeemul Haq Tariq, MingYue Sun, DianZhong Li, Yi Yi Li. Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding[J]. J. Mater. Sci. Technol., 2020, 46: 1-11.

Figures/Tables 11

Fig. 1. (a) Microstructure of IN718 treated after homogenizing at 1100 ℃ for 1 h. (b) Schematic of isothermal compression bonding tests on hot compression bonding test device. (c) Shape and dimensions of the round bar-shaped specimen for isothermal compression bonding tests. (d) Morphology diagram of the specimens after isothermal compression bonding process. (e) Area selected for observation of the microstructure of interfacial grain boundaries (IGBs). (f) Location and dimensions of the tensile test specimen.

Fig. 2. Optical microscopy images of IN718 joints under different bonding temperatures. (a) Microstructure in the bonding area at different deformation temperatures and strains. (b-e) Enlarged views of the blue dashed boxes in (a).

Fig. 3. Effects of strain and deformation temperature on (a) interfacial bonding ratio (ΨBonding) in the bonding area. (b) Method for calculating interfacial bonding ratio.

Fig. 4. Representative inverse pole figure maps of the bonding area of the joints obtained at ε = 0.50 under (a) 1000 °C, (b) 1050 °C, (c) 1100 °C, and (d) 1150 °C. Effect of deformation temperature on (e) the volume fraction of different types of grains and (f) color code.

Fig. 5. Grain boundary maps (superimposed on IQ maps) in the bonding area of the joints bonded at 1100 °C under deformation strains of: (a) 0.20, (b) 0.30, (c) 0.40, and (d) 0.50. (e, f) Enlarged views of the blue boxes marked in (a, d). (g, h) Misorientation angle (Δθ) profiles along the lines L1, L2, L3, and L4 marked in panels (e) and (f).

Fig. 6. (a, b) Inverse pole figure maps, (c, d) grain boundary maps (superimposed on IQ maps) and (e, f) kernel average misorientation maps of the bonding interface of the joints processed at 1100 °C under deformation strains of: (a, c, e) 0.20 and (b, d, f) 0.40. (g) Geometrically necessary dislocation density (ρGND) profiles along lines ‘AB’, ‘CD’, and ‘EF’ marked in panels (e) and (f).

Fig. 7. (a) TEM images showing dislocations evolution in the vicinity of the interfacial grain boundary at 1100 °C under a deformation strain of 0.10. (b) An enlarged view of the blue box marked in panel (a).

Fig. 8. (a) Room temperature tensile properties of the specimens bonded at different deformation temperatures and a deformation strain of 0.40. (b) Comparison between yield strengths (YSs), ultimate tensile strengths (UTSs), and elongations (ELs) obtained from the tensile curves in (a).

Fig. 9. SEM images of the fractured surfaces of tensile test specimens bonded at ε = 0.40 and different deformation temperatures: (a, e) 1000 ℃, (b, f) 1050 ℃, (c, g) 1100 ℃, (d, h) 1150 ℃.

Fig. 10. Schematic diagrams of DRX nucleation and growth at interfacial grain boundary. (a) Deformation generated in the initial interfacial grains. (b) A section of grain boundary bulges into the opposite side of the interfacial grain boundary to form a nucleus of dynamic recrystallization caused by strain-induced grain boundary migration (SIBM). (c) Nucleation and growth of DRXed grain in the vicinity of the interfacial grain boundary leading to a sound bonded joint.

Fig. 11. Effects of strain and deformation temperature on (a) average grain size, (b) average size of newly formed DRXed grains.

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