J. Mater. Sci. Technol. ›› 2018, Vol. 34 ›› Issue (9): 1467-1473.DOI: 10.1016/j.jmst.2018.02.025
• Orginal Article • Previous Articles Next Articles
Aihua Jiang, Meng Qi, Jianrong Xiao*()
Received:
2017-07-28
Revised:
2017-09-14
Accepted:
2017-11-01
Online:
2018-09-20
Published:
2018-09-25
Contact:
Xiao Jianrong
Aihua Jiang, Meng Qi, Jianrong Xiao. Preparation, structure, properties, and application of copper nitride (Cu3N) thin films: A review[J]. J. Mater. Sci. Technol., 2018, 34(9): 1467-1473.
Fig. 2. XRD spectra of Cu3N films deposited at different r, and the discharge power and substrate temperature were maintained at 100 W and 393 K, respectively. (Ref. [22]).
Fig. 8. (a) XRD spectra of Cu3N thin films deposited at r = 0.5 before and after annealed; (b) thermal analysis of Cu3N thin films deposited at various r [22].
Fig. 9. (a) Microscopic image after the electron beam writing of surface area of 3 mm × 3 mm and 1 mm × 1 mm. An array of dots was observed in the exposed area of a 20 kV electron beam [28]; (b) Data written on a Cu3N-layer. Linear velocity 3.5 m/s, pulse power 28 mW, pulse length 250, 300, 350, and 400 ns, and the smallest diameter of a single bit is 0.9 mm [90].
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