C60 intercalating Ti3C2Tx MXenes assisted by γ-cyclodextrin for electromagnetic interference shielding films with high stability

doi:10.1016/j.jmst.2022.03.022

Abstract

Abstract:

Ti₃C₂T_x MXenes with excellent metallic conductivity and flexibility have shown a promising prospect as electromagnetic interference (EMI) shielding materials. Ultrathin, hierarchical hybrid films were fabricated by using C₆₀ intercalating Ti₃C₂T_x MXenes with the assistance of water-soluble γ-cyclodextrin (CD). The C₆₀/CD complex was obtained by high-speed vibration milling using hydrophilic CD as dispersing agent. After thermal annealing treatment, the obtained hybrid film exhibited excellent EMI shielding (53.52±0.43 dB), hydrophobicity (water contact angle: 93.7°) and mechanical stability (over 0.9 million bending times). Taking advantage of the antioxidant of C₆₀, the chemical durability of Ti₃C₂T_x MXenes based hybrid films was also improved as expected. These results indicate that the well-designed hierarchical hybrid films with the intercalation of C₆₀ have promising potential for high-performance EMI shielding applications.

Key words: Ti₃C₂T_x MXenes, C₆₀, High conductivity, Stability, EMI shielding

Kunpeng Qian, Shuang Li, Jianhui Fang, Yuhuan Yang, Shaomei Cao, Miao Miao, Xin Feng. C₆₀ intercalating Ti₃C₂T_x MXenes assisted by γ-cyclodextrin for electromagnetic interference shielding films with high stability[J]. J. Mater. Sci. Technol., 2022, 127: 71-77.

Figures/Tables 6

Fig. 1. (a, b) SEM images of Ti3AlC2 and accordion-like Ti3C2Tx. (c) TEM image of Ti3C2Tx MXenes. (d, e) SEM images of C60. (f, g) SEM images of CD and C60/CD complex. (h) Schematic illustration for the fabrication of aCCMF.

Fig. 2. (a-d) Cross-sectional SEM images of aCCMF1, aCCMF2, aCCMF3 and aCCMF5. (e-h) Amplified cross-sectional SEM images of aCCMF1, aCCMF2, aCCMF3 and aCCMF5. (i-l) Digital pictures and the corresponding surface SEM images of aCCMF1, aCCMF2, aCCMF3 and aCCMF5.

Fig. 3. (a) XRD patterns of pMF, pCCMF5 and aCCMF5. (b) FT-IR curves of CD, C60, C60/CD, pCCMF5 and aCCMF5. (c) XPS spectra of pCCMF5 and aCCMF5. (d) Ti 2p and (e) O 1?s XPS spectra of pCCMF5 and aCCMF5. (f) Raman spectra of CD, C60, C60/CD, pCCMF5 and aCCMF5.

Fig. 4. (a) TG/DSC curves of aCCMF5 and TG curve of CD. (b) Tensile stress-strain curves of aCMF, aCCMF1, aCCMF2, aCCMF3 and aCCMF5. (c) Tensile stress and strain at the fracture of aCMF, aCCMF1, aCCMF2, aCCMF3 and aCCMF5. (d) Digital picture of broken aCCMF5 with “zigzag” crack and the stretching diagram.

Fig. 5. (a) Electrical conductivity and thickness of the hybrid films before and after annealing treatment. (b) EMI SE of aCMF, aCCMF1, aCCMF2, aCCMF3 and aCCMF5. (c) Average SEA, SER and SET of the hybrid films before and after annealing treatment. (d) Average R, A and T coefficients of aCMF, aCCMF1, aCCMF2, aCCMF3 and aCCMF5. (e) The variation of EMI SE and electrical conductivity for aCCMF5 with folding times and the insets show the water contact angle of aCMF (left) and aCCMF5 (right). (f) The variation of EMI SE and electrical conductivity of aCCMF5 and aCMF in a humid environment (80% humidity) for 7 days. (g) EMI shielding mechanism of aCCMF.

Fig. 6. SSE/t of aCMF, aCCMF1, aCCMF2, aCCMF3 and aCCMF5 (indicated by the red star) with other EMI shielding based materials with different thicknesses. The listed numbers are the reference numbers in Supporting Material.

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C₆₀ intercalating Ti₃C₂T_x MXenes assisted by γ-cyclodextrin for electromagnetic interference shielding films with high stability

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