J. Mater. Sci. Technol. ›› 2022, Vol. 124: 121-134.DOI: 10.1016/j.jmst.2022.03.003
• Research Article • Previous Articles Next Articles
Yunfa Guo, Yan Jin Lee, Yu Zhang, Hao Wang()
Received:
2022-02-08
Revised:
2022-03-11
Accepted:
2022-03-12
Published:
2022-10-10
Online:
2022-03-30
Contact:
Hao Wang
About author:
∗E-mail address: mpewhao@nus.edu.sg (H. Wang).Yunfa Guo, Yan Jin Lee, Yu Zhang, Hao Wang. Magneto-plasticity in micro-cutting of single-crystal copper[J]. J. Mater. Sci. Technol., 2022, 124: 121-134.
Fig. 2. Experimental micro-cutting setup: (a) magnetic field-assisted machining setup using an electromagnet on an ultra-precision machine center; (b) illustration of the varying magnetic field directions relative to the micro-cutting test direction; (c) schematic of the reverse in polarity of the electromagnets.
Empty Cell | Parameters | Values |
---|---|---|
Workpiece | Material | Single-crystal copper |
Empty Cell | Dimension | Ø12 mm × 10 mm |
Empty Cell | Crystal plane | (111) |
Tool | Material | Single-crystal diamond (SCD) |
Empty Cell | Rake angle | 0° |
Empty Cell | Nose radius (rn) | 0.8 mm |
Empty Cell | Tool holder material | Aluminium alloy (non-magnetic) |
Cutting parameters | Undeformed chip thickness t0 (υc = 20 mm/min) | 2, 5, 8, 10 μm |
Empty Cell | Cutting speed υc (t0 = 10 μm) | 5, 20, 50, 100 mm/min |
Empty Cell | Cutting length | 3.5 mm |
Empty Cell | Cutting direction | [ |
Magnetic field | Magnetic field source | Electromagnet |
Empty Cell | Magnetic field directions | 0°, 30°, 60°, 90° relative to cutting direction |
Empty Cell | Magnetic field intensity | 0, 20, 40 mT |
Empty Cell | Magnetic field polarity | N-S, S-N |
Table 1. Experimental parameters for the micro-cutting tests.
Empty Cell | Parameters | Values |
---|---|---|
Workpiece | Material | Single-crystal copper |
Empty Cell | Dimension | Ø12 mm × 10 mm |
Empty Cell | Crystal plane | (111) |
Tool | Material | Single-crystal diamond (SCD) |
Empty Cell | Rake angle | 0° |
Empty Cell | Nose radius (rn) | 0.8 mm |
Empty Cell | Tool holder material | Aluminium alloy (non-magnetic) |
Cutting parameters | Undeformed chip thickness t0 (υc = 20 mm/min) | 2, 5, 8, 10 μm |
Empty Cell | Cutting speed υc (t0 = 10 μm) | 5, 20, 50, 100 mm/min |
Empty Cell | Cutting length | 3.5 mm |
Empty Cell | Cutting direction | [ |
Magnetic field | Magnetic field source | Electromagnet |
Empty Cell | Magnetic field directions | 0°, 30°, 60°, 90° relative to cutting direction |
Empty Cell | Magnetic field intensity | 0, 20, 40 mT |
Empty Cell | Magnetic field polarity | N-S, S-N |
Fig. 3. Recorded cutting forces plots: (a) varying magnetic field intensity and polarity; (b) varying magnetic field directions during the micro-cutting process; (c) consolidated average cutting force measurements with respect to the magnetic field direction, intensity, and polarity for t0 = 10 μm and υc = 20 mm/min. (NMF: no magnetic field. MF: with magnetic field).
Fig. 4. Consolidated average cutting force measurements (column graph) and percent reduction in cutting force (line + symbol graph) for varying magnetic field orientations (20 mT & N-S) with respect to (a) cutting speed (t0 = 10 μm) and (b) uncut chip thickness (υc = 20 mm/min) on cutting force. (NMF: no magnetic field. MF: with magnetic field).
Fig. 7. Comparison of experimental and theoretical relative change of cutting forces and at B=20 mT. For theoretical calculation, and B0 is estimated as 215 mT for copper [29], and the value of proportionality factor kρ is set as 1 [22].
Fig. 8. (a) Schematic of deformation behavior and chip formation during orthogonal cutting. (b) Slip planes and slip directions in (111) single crystal. (c) Magnetic-induced transition in dislocation flow mode and cross-section of chip during chip formation. (d) Formation mechanism of surface folds on the free side of chip at different magnetic conditions.
Slip plane | Slip direction | Values of m |
---|---|---|
(111) | [ | 0 |
[ | 0 | |
[ | 0 | |
( | [110] | 0 |
[101] | 0.41 | |
[ | 0.41 | |
( | [110] | 0 |
[ | 0.41 | |
[011] | 0.41 | |
( | [ | 0 |
[101] | 0 | |
[011] | 0 |
Table 2. Schmid factors when cut along the (111)[$\bar{1}10$] crystal direction.
Slip plane | Slip direction | Values of m |
---|---|---|
(111) | [ | 0 |
[ | 0 | |
[ | 0 | |
( | [110] | 0 |
[101] | 0.41 | |
[ | 0.41 | |
( | [110] | 0 |
[ | 0.41 | |
[011] | 0.41 | |
( | [ | 0 |
[101] | 0 | |
[011] | 0 |
Fig. 9. Values of orientation factor mO with magnetic field direction for activated slip systems. (mO1 = average values of orientation factor in ($\bar{1}11$)[$0\bar{1}1$] and ($1\bar{1}1$)[$10\bar{1}$] slip systems. mO2 = average values of orientation factor in ($\bar{1}11$)[101] and ($1\bar{1}1$)[011] slip systems.)
Fig. 10. Optical microscopic and AFM imaging of the machined surfaces under varying magnetic field conditions for t0 = 10 μm and υc = 20 mm/min and the observable surface textures: transverse micro-stripes (T1), diagonal folds (T2), crater zone (T3), and “mushroom-like” folds (T4).
Fig. 11. Machined surface profile measurements: top view of the machined surface produced (a) without magnetic field, (b) with a magnetic field (90°), surface roughness profiles along (c) Path 1 (P1), Path 2 (P2), and Path 3 (P3) in the absence and presence of magnetic field (90°).
Fig. 13. Transmission electron microscopic (TEM) analysis of the subsurface produced without magnetic field: (a) cross-sectional side view of the machined subsurface, (b) selected area electron diffraction (SAED) pattern of region A in (a), and (c) high-magnification bright-field image of region B in (a).
Fig. 14. TEM analysis of the subsurface produced with magnetic field: (a) cross-sectional side view of the machined subsurface, (b) SAED patterns of region A in (a), and (c) SAED pattern of region B in (a).
Fig. 15. Cutting-induced microhardness at the magnetic-free condition and varying magnetic field for t0 = 10 μm and υc = 20 mm/min: (a) indentation curves; (b) measured microhardness and elastic modulus.
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