J. Mater. Sci. Technol. ›› 2021, Vol. 90: 225-235.DOI: 10.1016/j.jmst.2021.02.035
• Research Article • Previous Articles Next Articles
Jinseo Kima, Le Thai Duyb, Hyunwoo Kanga, Byungmin Ahna,b,*(
), Hyungtak Seoa,b,*(
)
Received:2020-12-11
Revised:2021-02-21
Accepted:2021-02-28
Published:2021-11-05
Online:2021-11-05
Contact:
Byungmin Ahn,Hyungtak Seo
About author:hseo@ajou.ac.kr (H. Seo).1 These authors contribute equally to this work.
Jinseo Kim, Le Thai Duy, Hyunwoo Kang, Byungmin Ahn, Hyungtak Seo. Fluorine doping for improved thermoelectric properties of spark plasma sintered bismuth telluride[J]. J. Mater. Sci. Technol., 2021, 90: 225-235.
Fig. 1. (a-h) AFM images showing the surface morphology of pristine and F-doped Bi2Te3 samples with different plasma treatment time (tP = 0-70 s), respectively. Here, the analyzed sample area is 2 μm × 2 μm. (i) RMS roughness of those samples as a function of tP.
Fig. 3. (a) XRF results showing the content of Bi, Te, and F elements in pristine and F-doped Bi2Te3 samples. (b) Magnified XRF profile of F dopants as a function of tP. (c) TOF-SIMS depth profiles of Bi and Te in a pristine sample. (d) TOF-SIMS depth profiles of F in pristine and F-doped samples.
Fig. 4. (a, b) High-resolution TEM images of Bi2Te3 samples compacted at 533 K, respectively. The inset images show FFT results recorded from the focused area (1 nm × 1 nm). (c, d) EDS data of pristine and F-doped samples (tP = 0 and 40 s), respectively.
Fig. 5. (a) Wide-scan XPS survey of compacted samples at 533 K with the use of Ar etching. Here, XPS peaks noted with numbers from 1 to 11 correspond to Te 3p, Te (MNN), Bi 4p, Te 3d, O 1 s, Bi 4d, Bi 4f, Te 4d, Bi 5d, F 1 s, and C 1 s, respectively. Gaussian-fitted components in XPS peaks: (b) C 1 s, (c) O 1 s, (d) F 1 s (Bi 4p), (e) Te 3d, and (f) Bi 4f of Bi2Te3 sample after Ar etching and F-doped-Bi2Te3 sample before and after Ar etching.
| Chemical components (Binding energy (eV)) | Areal percentage (%) | ||
|---|---|---|---|
| Bi2Te3 after etching | F-doped Bi2Te3 before etching | F-doped Bi2Te3 after etching | |
| Carbon (C 1 s) | |||
| C-C (284.5)/ C—O (285.2) | 90.3/ 9.7 | 99.5/ 0.5 | 93.1/ 6.9 |
| Oxygen (O 1 s) | |||
| Metal-oxide O2- (530.3)Dangling O- (530.9)Absorbed O (531.7) | 56.812.430.8 | 50.918.031.1 | 42.032.026.0 |
| Fluorine (F 1 s) | |||
| Substitutional F - 1 (685.50) Interstitial F0 (687.75) | - - | 15.520.6 | |
| Tellurium (Te 3d) | |||
| Te+2 in Bi2Te3 (572.5, 582.9)Te+3 in Bi2Te3 (572.9, 583.3)Te+4 in Bi2Te3 (573.6, 584.0)Te+2 in TeO2 (576.15, 586.45) | 62.519.713.24.6 | 13.19.214.363.4 | 39.425.113.621.9 |
| Bismuth (Bi 4f) | |||
| Bi+3 in Bi2Te3 (156.8, 162.2)Bi+4 in Bi2Te3 (157.7, 163.1)Bi+5 in Bi2Te3 (158.8, 164.2)Bi+3 in Bi2O3 (159.2, 164.6) | 64.530.05.20.3 | 55.817.214.812.2 | 44.126.128.21.6 |
Table 1 Binding energy and areal percentage of components of C 1 s, O 1 s, F 1 s, Te 3d, and Bi 4f extracted from the high-resolution XPS spectra of pristine and F-doped samples.
| Chemical components (Binding energy (eV)) | Areal percentage (%) | ||
|---|---|---|---|
| Bi2Te3 after etching | F-doped Bi2Te3 before etching | F-doped Bi2Te3 after etching | |
| Carbon (C 1 s) | |||
| C-C (284.5)/ C—O (285.2) | 90.3/ 9.7 | 99.5/ 0.5 | 93.1/ 6.9 |
| Oxygen (O 1 s) | |||
| Metal-oxide O2- (530.3)Dangling O- (530.9)Absorbed O (531.7) | 56.812.430.8 | 50.918.031.1 | 42.032.026.0 |
| Fluorine (F 1 s) | |||
| Substitutional F - 1 (685.50) Interstitial F0 (687.75) | - - | 15.520.6 | |
| Tellurium (Te 3d) | |||
| Te+2 in Bi2Te3 (572.5, 582.9)Te+3 in Bi2Te3 (572.9, 583.3)Te+4 in Bi2Te3 (573.6, 584.0)Te+2 in TeO2 (576.15, 586.45) | 62.519.713.24.6 | 13.19.214.363.4 | 39.425.113.621.9 |
| Bismuth (Bi 4f) | |||
| Bi+3 in Bi2Te3 (156.8, 162.2)Bi+4 in Bi2Te3 (157.7, 163.1)Bi+5 in Bi2Te3 (158.8, 164.2)Bi+3 in Bi2O3 (159.2, 164.6) | 64.530.05.20.3 | 55.817.214.812.2 | 44.126.128.21.6 |
Fig. 6. DFT calculation results of undoped Bi2Te3 supercell. (a, b) Band structure and density of states (DOS) of undoped Bi2Te3 supercell, respectively, plotted using BURAI. The results show that the Fermi level (normalized to 0 eV) of the undoped Bi2Te3 is almost in the middle of the bandgap (~0.368 eV). Here, 13 k-points (Γ, L, B1, B, Z, Γ, X, Q, F, P1, Z, L, and P) were used for obtaining the band structures.
Fig. 7. DFT calculation results of F-doped Bi2Te3 supercell. (a, b) Band structure and DOS of F-doped Bi2Te3 supercell having one interstitial F dopant, respectively. (c, d) Band structure and DOS of F-doped supercell in which two interstitial F dopants bind to one Te atom, respectively. (e) DOS of F-doped supercell where two interstitial F dopants bind to one Te atom and one Bi atom (in a Bi-Te pair). Here, red arrows indicate the positions of F dopants.
Fig. 8. DFT calculation results of F-doped Bi2Te3 supercell. (a, b) Band structure and density of states (DOS), respectively, of F-doped Bi2Te3 supercell where F dopant substituted the 40th Te atom. (c, d) DOS of F-doped Bi2Te3 supercells where F dopant substituted the 5th and 30th Te atoms, respectively. Here, red arrows indicate the positions of F dopants in the supercell models. Here, red arrows indicate the positions of F dopants.
Fig. 9. (a) Hall coefficients of pristine and F-doped samples (tP = 0 and 40 s) showing that electron is their main charge carrier. (b) Bulk concentration, conductivity, and Hall carrier mobility of the pristine and F-doped samples measured at 273 and 345 K.
Fig. 10. Thermoelectric properties of Bi2Te3 samples with tP = 0-70 s. Their temperature-dependent changes in (a) electrical conductivity (σ), (b) Seebeck coefficient (α), (c) total thermal conductivity (kT), (d) electronic thermal conductivity (ke), (e) lattice thermal conductivity (kL), and (f) figures of merit (ZT).
| Refs. | Materials | Sample fabrication method | ZT and temperature |
|---|---|---|---|
| [ | I-doped Bi2Te2.9I0.1 | hydrothermal + hot pressing. | 1.1 at 448 K |
| [ | I-doped Bi2Te2.4Se0.6 | mechanical alloying + hot pressing. | 0.84 at 473 K |
| [ | I-doped Bi2Te2.4Se0.6Te-excessive Bi2Te2.41Se0.6 | SPS + annealing. | 1.0 at 400 K0.8 at 300-600 K |
| [ | I-doped Bi1.9Sb0.1Te2.85Se0.15 | melting + hot pressing | 0.84 at 473 K |
| [ | Cl-doped Bi2O2Se0.985Cl0.015 | ball-milling + SPS | 0.23 at 823 K |
| [ | Cl-doped Bi1.2Sb0.8Se3 | melting + SPS | 0.68 at 700 K |
| [ | Br-doped Bi2Te2.7Se0.3 | solid solution | ~ 0.75 at 300 K |
| [ | Br‐doped SnSe0.88Br0.12 | melting + hot pressing | ~ 1.3 at 773 K |
| [ | CuI/Sn-co-doped Bi2Te3 (2 phases) | melting + SPS | ~1.02 at 300-525 K |
| [ | Cu-doped Cu0.06Bi2Te3.17 | melting + SPS | 0.85 at ~ 423K |
| [ | K-doped K0.06Bi2Te3.18 | nano-synthesis + SPS | ~1.1 at 323 K |
| [ | Cr-doped Bi1.99Cr0.01Te3 | melting + SPS | ~0.4 at 375-400 K |
| Here | F-doped Bi2Te3 (2 at%) | SPS + RIE (SF6) | 1.1 at 390 K |
Table 2 Comparison of ZT performance of some n-type thermoelectric composites doped with halide and other elements.
| Refs. | Materials | Sample fabrication method | ZT and temperature |
|---|---|---|---|
| [ | I-doped Bi2Te2.9I0.1 | hydrothermal + hot pressing. | 1.1 at 448 K |
| [ | I-doped Bi2Te2.4Se0.6 | mechanical alloying + hot pressing. | 0.84 at 473 K |
| [ | I-doped Bi2Te2.4Se0.6Te-excessive Bi2Te2.41Se0.6 | SPS + annealing. | 1.0 at 400 K0.8 at 300-600 K |
| [ | I-doped Bi1.9Sb0.1Te2.85Se0.15 | melting + hot pressing | 0.84 at 473 K |
| [ | Cl-doped Bi2O2Se0.985Cl0.015 | ball-milling + SPS | 0.23 at 823 K |
| [ | Cl-doped Bi1.2Sb0.8Se3 | melting + SPS | 0.68 at 700 K |
| [ | Br-doped Bi2Te2.7Se0.3 | solid solution | ~ 0.75 at 300 K |
| [ | Br‐doped SnSe0.88Br0.12 | melting + hot pressing | ~ 1.3 at 773 K |
| [ | CuI/Sn-co-doped Bi2Te3 (2 phases) | melting + SPS | ~1.02 at 300-525 K |
| [ | Cu-doped Cu0.06Bi2Te3.17 | melting + SPS | 0.85 at ~ 423K |
| [ | K-doped K0.06Bi2Te3.18 | nano-synthesis + SPS | ~1.1 at 323 K |
| [ | Cr-doped Bi1.99Cr0.01Te3 | melting + SPS | ~0.4 at 375-400 K |
| Here | F-doped Bi2Te3 (2 at%) | SPS + RIE (SF6) | 1.1 at 390 K |
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