Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al

J Mater Sci Technol ›› 2011, Vol. 27 ›› Issue (9): 856-860.

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Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al

B. Xu¹⁾, W.P. Tong¹⁾, C.Z. Liu²⁾, H. Zhang¹⁾, L. Zuo¹⁾, J.C. He¹⁾

1) Key Laboratory of National Education Ministry for Electromagnetic Processing of Materials, Northeastern University, Shenyang 110004, China
2) Department of Materials Engineering, Shenyang Institute of Aeronautical Engineering, Shenyang 110034, China

Received:2010-07-29 Revised:2010-09-12 Online:2011-09-28 Published:2011-09-28
Contact: Weiping Tong
Supported by:
the National Natural Science Foundation of China (No. 50871026), the 111 Project (B07015), Foundation for the Author of National Excellent Doctoral Dissertation of China (No. 200745), Program for New Century Excellent Talents in University (NCET-06-0288), and the Fundamental Research Funds
for the Central Universities (N090109001)

Abstract

Abstract: The effect of magnetic field on the growth behavior of compound layer was examined at the interface between the solid Cu and liquid Al during reactive diffusion. It was found that the thickness of compound layer was reduced by the high magnetic field. The growth activation energy in β, γ₁ and "2 layers under a high magnetic field was larger than those in non magnetic circumstances, the increment percentage being 4.8%, 13.3% and 5.5%, respectively.

Key words: Diffusion, Activation energy, High magnetic field, Al, Cu

B. Xu, W.P. Tong, C.Z. Liu, H. Zhang, L. Zuo, J.C. He. Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al[J]. J Mater Sci Technol, 2011, 27(9): 856-860.

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Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al

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