[1] |
Kaiming Cheng, Jiaxing Sun, Huixia Xu, Jin Wang, Chengwei Zhan, Reza Ghomashchi, Jixue Zhou, Shouqiu Tang, Lijun Zhang, Yong Du.
Diffusion growth of ϕ ternary intermetallic compound in the Mg-Al-Zn alloy system: In-situ observation and modeling
[J]. J. Mater. Sci. Technol., 2021, 60(0): 222-229.
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[2] |
Zongye Ding, Qiaodan Hu, Wenquan Lu, Fan Yang, Yihan Zhou, Naifang Zhang, Sheng Cao, Liao Yu, Jianguo Li.
Intergrowth mechanism and morphology prediction of faceted Al3Ni formed during solidification by a spatial geometric model
[J]. J. Mater. Sci. Technol., 2020, 54(0): 40-47.
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[3] |
Zheng Chen, Mingli Qin, Junjun Yang, Lin Zhang, Baorui Jia, Xuanhui Qu.
Effect of La2O3 addition on the synthesis of tungsten nanopowder via combustion-based method
[J]. J. Mater. Sci. Technol., 2020, 58(0): 24-33.
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[4] |
E. Burzo, P. Vlaic, D.P. Kozlenko, N.O. Golosova, S.E. Kichanov, B.N. Savenko, A. Ostlin, L. Chioncel.
Structure and magnetic properties of YCo5 compound at high pressures
[J]. J. Mater. Sci. Technol., 2020, 42(0): 106-112.
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[5] |
Bo Chen, Wen-Jiang Zou, Wen-Wen Li, Shi-Biao Wu, Hua-Ping Xiong, Xin Wu.
Joining of SiO2f/SiO2 composite to Nb using Ag-Cu-In-Ti brazing alloys
[J]. J. Mater. Sci. Technol., 2020, 50(0): 13-20.
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[6] |
Qian Yan, Bo Song, Yusheng Shi.
Comparative study of performance comparison of AlSi10Mg alloy prepared by selective laser melting and casting
[J]. J. Mater. Sci. Technol., 2020, 41(0): 199-208.
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[7] |
Anil Kunwar, Lili An, Jiahui Liu, Shengyan Shang, Peter Råback, Haitao Ma, Xueguan Song.
A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
[J]. J. Mater. Sci. Technol., 2020, 50(0): 115-127.
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[8] |
Anil Kunwar, Yuri Amorim Coutinho, Johan Hektor, Haitao Ma, Nele Moelans.
Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
[J]. J. Mater. Sci. Technol., 2020, 59(0): 203-219.
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[9] |
T. Sapanathan, N. Jimenez-Mena, I. Sabirov, M.A. Monclús, J.M. Molina-Aldareguía, P. Xia, L. Zhao, A. Simar.
A new physical simulation tool to predict the interface of dissimilar aluminum to steel welds performed by friction melt bonding
[J]. J. Mater. Sci. Technol., 2019, 35(9): 2048-2057.
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[10] |
Zongye Ding, Qiaodan Hu, Wenquan Lu, Xuan Ge, Sheng Cao, Siyu Sun, Tianxing Yang, Mingxu Xia, Jianguo Li.
In-situ study on hydrogen bubble evolution in the liquid Al/solid Ni interconnection by synchrotron radiation X-ray radiography
[J]. J. Mater. Sci. Technol., 2019, 35(7): 1388-1392.
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[11] |
Z. Shen, Y. Dingd, J. Chen, B. Shalch Amirkhiz, J.Z. Wen, L. Fu, A.P. Gerlich.
Interfacial bonding mechanism in Al/coated steel dissimilar refill friction stir spot welds
[J]. J. Mater. Sci. Technol., 2019, 35(6): 1027-1038.
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[12] |
L.H. Wu, K. Nagatsuka, K. Nakata.
Achieving superior mechanical properties in friction lap joints of copper to carbon-fiber-reinforced plastic by tool offsetting
[J]. J. Mater. Sci. Technol., 2018, 34(9): 1628-1637.
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[13] |
Zi-You Ding, Lan-Yue Cui, Rong-Chang Zeng, Yan-Bin Zhao, Shao-Kang Guan, Dao-Kui Xu, Cun-Guo Lin.
Exfoliation corrosion of extruded Mg-Li-Ca alloy
[J]. J. Mater. Sci. Technol., 2018, 34(9): 1550-1557.
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[14] |
Qun Luo, Kang Li, Qian Li.
Thermodynamic investigation of phase equilibria in Al-Si-V system
[J]. J. Mater. Sci. Technol., 2018, 34(9): 1592-1601.
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[15] |
Li-Yin Gao, Hao Zhang, Cai-Fu Li, Jingdong Guo, Zhi-Quan Liu.
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
[J]. J. Mater. Sci. Technol., 2018, 34(8): 1305-1314.
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