Abstract: By means of electron probe(EPMA),scanning electron microscope(SEM),and optical microscope (QM),the diffusion behaviour on the Fe-Cu interface of copper brazed double-wall steel tubes and the microstructure of the diffusion layer have been investigated.There are three kinds of metallurgical bonds between copper plating layer and steel substrate: (1)the Cu diffusing into steel substrate along grain boundary of ferrite;(2)the Cu diffusion into grain bulk of ferrite: (3)the Fe diffusing into Cu layer.The copper brazed double-wall steel tubes are formed by the combination of the diffusions mentioned above and this is the reason for excellent mechanical and technological properties of the copper brazed double-wall steel tubes.

Key words: metallurgical bond, Bundyweld tube, diffusion behaviour, interface