Fig. 1. Section views of the residual stress distribution inside the composite materials that cooled from (a) 1300 K, (b) 1200 K and (c) 1000 K to 300 K, while (d) shows the stress distribution of the composites at 300 K without cooling process. The SiC is marked by dashed circle.

Fig. 2. Radial stress distribution in the matrix for composites after cooling from different temperatures.

Fig. 3. (a) A slice shows the displacement change of the atoms in composites cooled from 1300 to 300 K. (b) is an enlarged view of displacement vector of the local interface as in the dotted frame in (a). The yellow arrows in (b) indicate the changes in position for each atom with respect to its original coordinate at 1300 K, and the length of the arrow represents the magnitude of displacement.

Fig. 4. Dislocations in the composites: (a) dislocation density vs temperature during the cooling processes with different initial elevated temperatures; (b) the concentration of vacancy in matrices with different temperatures before the cooling.

Fig. 5. The evolution of dislocation line length and the proportions of the partial and stair rod dislocation vary with temperature during the cooling processes: (a, d) 1300 to 300 K, (b, e) 1200 to 300 K and (c, f) 1000 to 300 K.

Fig. 6. Dislocation networks of the composite materials at the end stages of 300 K for cooling down from (a) 1300 K, (b) 1200 K, (c) 1000 K and (d) 900 K. The central spheres are the SiC particles, and Cu atoms have been deleted.

Fig. 7. (a) Stair-rod dislocation found at the final stage in the composite model cooled from 1300 K, where (b) and (c) shows the corresponding dislocation reaction of this process. Burgers vectors are represented by the Thompson's notation.

Fig. 8. (a-c) ISFTs found with different appearances at the end stage of cooling, only atoms in the hcp environment are retained, and dislocation lines are colored as in Fig. 6. (d). An example (1000 K case) of the overall appearance of the stacking faults around the reinforcement, and Cu atoms in the fcc environment have been removed.

Fig. 9. Formation process of an ISFT in the model cooled from 1000 K. Only the atoms in hcp environment are left. Dislocation lines of Shockley partial and stair rod are colored as green and magenta, respectively.

Fig. 10. The proportions of Cu atoms in disorder (other), fcc (left vertical scale) and hcp (right vertical scale) structures vary with temperatures during the cooling processes.

Fig. 11. (a) A slice shows local structure of an ISFT. The atoms in fcc, hcp and disorder structures are colored as green, red and white, respectively. (b) The corresponding local stress distribution.