J. Mater. Sci. Technol. ›› 2019, Vol. 35 ›› Issue (10): 2144-2155.DOI: 10.1016/j.jmst.2019.05.051

• Orginal Article • Previous Articles     Next Articles

Low-valence ion addition induced more compact passive films on nickel-copper nano-coatings

Quangquan Doae, Hongze Ana, Guozhe Mengab*(), Weihua Lib*(), Lai-Chang Zhangd, Yangqiu Wanga, Bin Liua, Junyi Wanga, Fuhui Wangac   

  1. a Corrosion and Protection Laboratory, Key Laboratory of Superlight Materials and Surface Technology (Harbin Engineering University), Ministry of Education, Harbin, 150001, China
    b Corrosion and Protection Institute, School of Chemical Engineering and Technology, Sun Yat-Sen University, Zhuhai, 519082, China
    c Corrosion and Protection Division, Shenyang National Laboratory for Material Science, Northeastern University, Shenyang, 110819, China
    d School of Engineering, Edith Cowan University, 270 Joondalup Drive, Joondalup, Perth, WA, 6027, Australia
    e Shipbuilding Faculty, Viet Nam Maritime University, Haiphong, Viet Nam
  • Received:2019-02-19 Revised:2019-03-04 Accepted:2019-05-24 Online:2019-10-05 Published:2019-08-28
  • Contact: Meng Guozhe,Li Weihua

Abstract:

Ni-Cu nano-coatings were prepared by pulsed electroplating technique in the baths containing various amount of boric acid. Their microstructure, morphologies and corrosion resistance were characterized in detail. The addition of boric acid strongly influences on the microstructure of the Ni-Cu coatings. The coating with a grain size of 130 nm, obtained from the bath containing 35 g L-1 boric acid, shows the highest corrosion resistance. This is attributed to the low-valence Cu ion (Cu+) additions in nickel oxide, which could significantly decrease the oxygen ion vacancy density in the passive film to form a more compact passive film. The higher Cu+ additions and the lower diffusivity of point defects (D0) are responsible for the formation of more compact passive film on the coating obtained from the bath with 35 g L-1 boric acid.

Key words: Passive film, Point defect, Corrosion, Electroplating, Coating