Tensile ductility and deformation mechanisms of a nanotwinned 316L austenitic stainless steel

doi:10.1016/j.jmst.2019.02.008

Abstract

Abstract:

A nanotwinned 316L austenitic stainless steel was prepared by means of surface mechanical grinding treatment. After recovery annealing, the density of dislocations decreases obviously while the average twin/matrix lamella thickness still keeps in the nanometer scale. The annealed nanotwinned sample exhibits a high tensile yield strength of ^～771 MPa and a considerate uniform elongation of ^～8%. TEM observations showed that accommodating more dislocations and secondary twinning inside the nanotwins contribute to the enhanced ductility and work hardening rate of the annealed nanotwinned sample.

Key words: Nanotwinned, Stainless steel, Ductility, Deformation mechanism

Y.Z. Zhang, J.J. Wang, N.R. Tao. Tensile ductility and deformation mechanisms of a nanotwinned 316L austenitic stainless steel[J]. J. Mater. Sci. Technol., 2020, 36: 65-69.

Figures/Tables 5

Fig. 1. (a) Typical bright-field TEM image of the as-deformed nanotwinned sample and (b) the corresponding twin/matrix lamella thickness distribution. (c) The orientation of twin boundaries with respect to the treated surface.

Fig. 2. (a) Typical bright-field TEM image of the annealed nanotwinned sample and (b) the corresponding twin/matrix lamella thickness distribution.

Fig. 3. (a) True stress-strain curves and (b) work hardening rate (Θ=∂σ/∂εε˙) as a function of true strain for the as-deformed nanotwinned sample and annealed nanotwinned sample.

Fig. 4. (a) Fracture morphologies of the as-deformed nanotwinned sample after tension; (b), (c) The enlarged images of the areas B and C in (a); (d) The fracture morphologies of the annealed nanotwinned sample after tension; (e), (f) The enlarged images of the areas E and F in (d).

Fig. 5. Typical TEM image of the annealed nanotwinned sample after the tensile strain of 8%. (a) and (b) are the selected area electron diffraction patterns of the areas A and B, respectively.

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