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| Keywords | |
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Strength |
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Fracture strain |
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Voids |
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Solder |
| Authors | |
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YU Zhong-Guang |
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YU Xiao-Jing |
| PubMed | |
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Article by Yu,Z.G. |
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Article by Yu,X.J |
Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints
X.J. Wang1), Q.L. Zeng1), Q.S. Zhu1), Z.G. Wang1), J.K. Shang1,2)
1) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
2) Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
Effects of electromigration on microstructure, shear strength, and fracture behavior of solder joints were investigated by single-ball shear samples of eutectic Sn-3.8Ag-0.7Cu (SAC) joined by Cu plates at two sides. The electromigration tests were conducted at a current density of about 1.1×103 A/cm2 and a working temperature of about 83°C. The results showed that the shear strength and flow stress decreased greatly after current stressing. Such a decrease was associated with no significant loss of the fracture strain at short electromigration but a great reduction in the fracture strain after long-term current stressing. The variation of the fracture strain with the electromigration time was shown to result from the shift of the fracture surface from the center of the solder towards the intermetallic compound (IMC) interface at the cathode.
the National Basic Research Program of China (Grant Nos. 2004CB619306 and 2010CB631006)
| [1] | A. LaLonde, D. Emelande, J. Jeannette, C. Larson, W. Rietz, D. Swenson and D.W. Henderson: J. Electron. Mater, 2004, 33, 1545. |
| [2] | L.P. Lehman, S.N. Athavale, T.Z. Fullem, A.C. Giamis, R.K. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae, J. Wang, Y. Xing, L. Zavalij, P. Borgesen and E.J. Cotts: J. Electron. Mater, 2004, 33, 1429. |
| [3] | T.R. Bieler A.U. Telang, J.P. Lucas, K.N. Subramanian, L.P. Lehman, Y. Xing and E.J. Cotts: J. Electron. Mater, 2004, 33, 1412. |
| [4] | H. Gan and K.N. Tu: Effect of Electromigration on Intermetallic Compound Formation in Pb-free Solder-Cu Interfaces, Impact Reliability of Solder Joints, in IEEE Electronic components and Technology Conference, 2002, 1206. |
| [5] | H. Gan, W.J. Choi, G. Xu and K.N. Tu: JOM, 2002, 54, 34. |
| [6] | J.W. Yoon and S.B. Jung: J. Alloy. Compd, 2008, 458, 200. |
| [7] | I.A. Blech: J. Appl. Phys, 1976, 47, 1203. |
| [8] | C.C. Lu, S.J.Wang and C.Y. Liu: J. Electron. Mater, 2003, 32, 1515. |
| [9] | L. Zhang, Z.G. Wang and J.K. Shang: Scripta Mater, 2007, 56, 381. |
| [10] | J.A. Nucci, A. Straub, E. Bischoff, E. Arzt and C.A. Volkert: J. Mater. Res, 2002, 17, 2727. |
| [11] | J. Bohm, C.A. Volkert, R. MÄonig, T.J. Balk and E. Arzt: J. Electron. Mater, 2002, 31, 45. |
| [12] | F. Ren, J.W. Nah, K.N. Tu, B.S. Xiong and L.H.L. Pang: Appl. Phys. Lett, 2006, 89, 141914. |
| [13] | Everett C.C. Yeh, W.J. Choi and K.N. Tu: Appl. Phys. Lett., 2002, 28, 580. |
| [14] | K.N. Chiang, C.C. Lee and K.M. Chen: Appl. Phys. Lett, 2006, 88, 072102. |
| [15] | K.S. Siow and M. Manoharan: Mater. Sci. Eng. A, 2005, 404, 244. |
| [16] | M. Date, T. Shoji, M. Fujiyoshi, K. Sato and K.N. Tu: Impact Reliability of Solder Joints, in Proceedings of the 54th ECTC, Las Vegas, NV, 2004, 668. |
| [17] | F. Ren: L. Xu, X. Zhang, J. Nah, J.H.L. Pang and K.N. Tu: In-situ Study of the E®ect of Electromigration on Strain Evolution and Mechanical Property Orange in Lead-free Solder Joints, in Proceedings of the 2006 ECTC Meeting, San Diego, CA, 2006, , . |