Challenges in Atomic-Scale Characterization of High-k Dielectrics and Metal Gate Electrodes for Advanced CMOS Gate Stacks

Abstract

Abstract:

The decreasing feature sizes in complementary metal-oxide semiconductor (CMOS) transistor technology will require the replacement of SiO₂ with gate dielectrics that have a high dielectric constant (high-k) because as the SiO₂ gate thickness is reduced below 1.4 nm, electron tunnelling effects and high leakage currents occur in SiO₂, which present serious obstacles to future device reliability. In recent years significant progress has been made on the screening and selection of high-k gate dielectrics, understanding their physical properties, and their integration into CMOS technology. Now the family of hafnium oxide-based materials has emerged as the leading candidate for high-k gate dielectrics due to their excellent physical properties. It is also realized that the high-k oxides must be implemented in conjunction with metal gate electrodes to get sufficient potential for CMOS continue scaling. In the advanced nanoscale Si-based CMOS devices, the composition and thickness of interfacial layers in the gate stacks determine the critical performance of devices. To build up a full atomic-scale understanding of high-k gate stacks, including their ultimate electrical properties, a thorough atomic-scale physical analysis of these ultrathin gate stacks are highly required. High-resolution microscopic and spectroscopic methods are central in facilitating high-k gate dielectrics to be integrated in CMOS devices and to continue scaling. In this review, we summarize the strengths and capabilities of several high-resolution electron, ion, and photon-based techniques currently used to characterize the high-k gate dielectrics at atomic scale. Particularly, we review the enormous progresses on characterizing interface behavior and structural evolution in the high-k gate dielectrics by high-resolution transmission electron microscopy (HRTEM), and the related techniques based on scanning transmission electron microscopy (STEM), including high-angle annular dark-field (HAADF) imaging (also known as Z-contrast imaging), electron energy-loss spectroscopy (EELS), and energy dispersive X-ray spectroscopy (EDS). This review is organized into five sections. In the first section, we briefly introduce the working principles of each technique and outline their key features. And then we critically review the advances on microstructural characterization of high-k gate dielectrics at atomic scale by electron microscopy, citing some recent results reported on high

Key words: High-k gate dielectrics, Metal gate electrodes, CMOS gate stack, HRTEM, STEM

Xinhua Zhu,Jian-min Zhu,Aidong Li,Zhiguo Liu,Naiben Ming. Challenges in Atomic-Scale Characterization of High-k Dielectrics and Metal Gate Electrodes for Advanced CMOS Gate Stacks[J]. J Mater Sci Technol, 2009, 25(03): 289-313.

References

[1 ] D. Buchanan: IBM J. Res. Dev., 1999, 43, 245.
[2 ] M.L. Green, E.P. Gusev, R. Degraeve and E. Garfunkel: J. Appl. Phys., 2001, 90, 2057.
[3 ] G.D. Wilk, R.M. Wallace and J.M. Anthony: J. Appl. Phys., 2001, 89, 5243.
[4 ] E.P. Gusev: in Defects in SiO2 and Related Dielectrics: Science and Technology, ed. G. Pacchioni, Kluwer Academic Publishers, Dordrecht, Netherlands, 2000, 557.
[5 ] D.C. Gilmer, R. Hegde, R. Cotton, J. Smith, L. Dip, R. Garcia, V. Dhandapani, D. Triyoso, D. Roan, A. Franke, R. Rai, L. Prabhu, C. Hobbs, J.M. Grant, L. La, S. Samavedam, B. Taylor, H. Tseng and P. Tobin: Microelectron. Eng., 2003, 69, 138.
[6 ] M.S. Akbar, S. Gopalan, H.J. Cho, K. Onishi, R. Choi, R. Nieh, C.S. Kang, Y.H. Kim, J. Han, S. Krishnan and J.C. Lee: Appl. Phys. Lett., 2003, 82, 1757.
[7 ] L. Miotti, K.P. Bastos, G.V. Soares, C. Driemeier, R.P. Pezzi, J. Morais, I.J.R. Baumvol, A.L.P. Rotondaro, M.R. Visokay, J.J. Chambers, M. Quevedo-Lopez and L. Colombo: Appl. Phys. Lett., 2004, 85, 4460.
[8 ] M.A. Quevedo-Lopez, S.A. Kirshnan, P.D. Kirsch, G. Pant, B.E. Gnade and R.M. Wallace: Appl. Phys. Lett., 2005, 87, 262902.
[9 ] E.P. Gusev, C. Cabral, M. Copel, C.D. Emic and M. Gribelyuk: Microelectron. Eng., 2003, 69, 145.
[10] A.I. Kingon, J.P. Maria and S.K. Strei®er: Nature, 2000, 496, 1032.
[11] G.D. Wilk, R.M. Wallace and J.M. Anthony: J. Appl. Phys., 2001, 89, 5243.
[12] R.K. Sharma, A. Kumar and J.M. Anthony: JOM, 2001, 53.
[13] M. Houssa and M.M. Heyns: in High-k Gate Dielectrics, ed. M.Houssa, Institute of Physics Publishing, Bristol, 2004, 3.
[14] J. Robertson: Rep. Prog. Phys., 2006, 69, 327.
[15] E.P. Gusev, V. Narayanan and M.M. Frank: IBM J. Res. Dev., 2006, 50, 387.
[16] B.H. Lee, J.W. Oh, H.H. Tseng, R. Jammy and H. Huff: Materialstoday, 2006, 9, 32.
[17] G. He and L.D. Zhang: J. Mater. Sci. Technol., 2007, 23, 433.
[18] A.C. Diebolda, D. Venablesb, Y. Chabalc, D. Mullerc, M. Weldonc and E. Garfunkeld: Mater. Sci. Semicond. Process., 1999, 2, 103.
[19] B.W. Busch, O. Pluchery, Y.J. Chabal, D.A. Muller, R.L. Opila, J.R. Kwo and E. Garfunkel: MRS Bulletin, 2002, 27, 206.
[20] E. Garfunkeld, T. Gustafsson, P. Lysaght, S. Stemmer and R. Wallace: FUTURE FAB Inter., 21, 2006, Section 8.
[21] P.M. Voyles, D.A. Muller and E.J. Kirkland: Micros. Microanal., 2004, 10, 291.
[22] K.V. Benthem, A.W. Lupini, M. Kim, H.S. Baik, S. Doh, J.H. Lee, M.P. Oxley, J.T. Luck and S.J. Pennycook: Appl. Phys. Lett., 2005, 87, 034104.
[23] H. Rose: Optik, 1990, 85, 19.
[24] P.E. Batson, N. Dellby and O.L. Krivanek: Nature, 2002, 418, 617.
[25] H. Fukuda, M. Yasuda, T. Iwabuchi and S. Ohno: Appl. Surf. Sci., 1992, 60/61, 359.
[26] K. Kukli, M. Ritala, M. Leskela , T. Sajavaara, J. Keinonen, D.C. Gilmer, R. Hedge, R. Rai and L. Prabhu: J. Mater. Sci. Mater. Electron., 2003, 14, 161.
[27] T. Gustafsson, H.C. Lu, B.W. Busch, W.H. Schulte and E. Garfunkel: Nucl. Instrum. Meth. B, 2001, 183, 146.
[28] Y.P. Kim, S.K. Choi, H.K. Kim and D.W. Moon: Appl. Phys. Lett., 1997, 71, 3504.
[29] G.B. Alers, D.J. Werder, Y. Chabal, H.C. Lu, E.P. Gusev, E. Garfunkel, T. Gustafsson and R.S. Urdahl: Appl. Phys. Lett., 1998, 73, 1517.
[30] R.A.B. Devine: Appl. Phys. Lett., 1996, 68, 1924.
[31] X.B. Lu, Z.G. Liu, G.H. Shi, H.Q. Ling, H.W. Zhou, X.P. Wang and B.Y. Nguyen: Appl. Phys. A, 2004, 78, 921.
[32] J.L. Autran, R. Devine, C. Chaneliere and B. Balland: IEEE Electron Device Lett., 1997, 18, 447.
[33] K.A. Son, A.Y. Mao, Y.M. Sun, B.Y. Kim, F. Liu, A. Kamath, J.M. White, D.L. Kwong, D.A. Roberts and R.N. Vritis: Appl. Phys. Lett., 1998, 72, 1187.
[34] G.B. Alers, R.M. Fleming, Y.H. Wong, B. Dennis, A. Pinczuk, G. Redinbo, R. Urdahl, E. Ong and Z. Hasan: Appl. Phys. Lett., 1998, 72, 1308.
[35] G.B. Alers, D.J. Werder, Y. Chabal, H.C. Lu, E.P. Gusev, E. Garfunkel, T. Gustafsson and R. Urdahl: Appl. Phys. Lett., 1998, 73, 1517.
[36] M.B. Lee, M. Kawasaki and H. Koinuma: Jpn. J. Appl. Phys., 1995, 34, 808.
[37] H.S. Kim, D.C. Gilmer and D.L. Polla: Appl. Phys. Lett., 1996, 69, 3860.
[38] S.A. Campbell, D.C. Gilmer, X.C. Wang, M.T. Hsieh, H.S. Kim, W. Gladfelter and J. Yan: IEEE Trans. Electron Devices , 1997, 44, 104.
[39] S.M. George, O. Sneh and J.D. Way: Appl. Surf. Sci., 1994, 82/83, 460.
[40] R.D. Shannon: J. Appl. Phys., 1993, 73, 348.
[41] R.H. French: J. Am. Ceram. Soc., 1990, 73, 477.
[42] G.D. Wilk and R.M. Wallace: Appl. Phys. Lett., 1999, 74, 2854.
[43] G.D. Wilk and R.M. Wallace: Appl. Phys. Lett., 2000, 76, 112.
[44] Y.H. Wu, M.Y. Yang, A. Chin, W.J. Chen and C.M. Kwei: IEEE Electron. Device Lett., 2000, 21, 341.
[45] H.J. Osten, J.P. Liu and H.J. Mussig: Appl. Phys. Lett., 2002, 80, 297.
[46] J. Kwo, M. Hong, A.R. Kortan, K.T. Queeney, Y.J. Cabal, J.P. Mannaerts, T. Boone, J.J. Krajewski,
A.M. Sergent and J.M. Rosamilia: Appl. Phys. Lett., 2000, 77, 130.
[47] G.D. Wilk, R.M. Wallace and J.M. Anthony: J. Appl. Phys., 2001, 89, 5243.
[48] J.PÄaivÄasaari, M. Putkonen and L. NiinistÄo: Thin Solid Films, 2005, 472, 275.
[49] J.A. Gupta, D. Landheer, J.P. McCaffrey and G.I. Sproule: Appl. Phys. Lett., 2001, 78, 1718.
[50] M. Copel, E. Cartier and F.M. Ross: Appl. Phys. Lett., 2001, 78, 1607.
[51] T. Heeg, M. Wagner, J. Schubert, C. Buchal, M. Boese, M. Luysberg, E. Cicerrella and J.L. Freeouf: Microelectron. Eng., 2005, 80, 150.
[52] M. Wagner, T. Heeg, J. Schubert, C. Zhao, O. Richard, M. Caymax, V.V. Afanas and S. Mantl: Solid-State Electronics, 2006, 50, 58.
[53] P. Myllymaki, M. Nieminen, J. Niinisto, M. Putkonen, K. Kuklibc and L. Niinisto: J. Mater. Chem., 2006, 16, 563.
[54] K. Eisenbeiser, J.M. Finder, Z. Yu, J. Ramdani, J.A. Curless, J.A. Hallmark, R. Droopad, W.J. Ooms, L. Salem, S. Bradshaw and C.D. Overgaard: Appl. Phys. Lett., 2000, 76, 1324.
[55] S.B. Samavedam, L.B. La, J. Smith, S. DakshinaMurthy, E. Luckowski, J. Schae®er, M. Zavala, R. Martin, V. Dhandapani, D. Triyoso, H.H. Tseng, P.J. Tobin, D.C. Gilmer, C. Hobbs, W.J. Taylor,
J.M. Grant, R.I. Hegde, J. Mogab, C. Thomas, P. Abramowitz, M. Moosa, J. Conner, J. Jiang, V. Arunachalarn, M. Sadd, B.Y. Nguyen and B. White: IEDM Tech. Digest, 2001, 433.
[56] W. Tsai, L.A. Ragnarsson, L. Pantisano, P.J. Chen, B. Onsia, T. Schram, E. Cartier, A. Kerber, E. Young, M. Caymax, S.D. Gendt and M. Heyns: IEDM Tech. Digest, 2003, 311.
[57] E. Cartier, F.R. McFeely, V. Narayanan, P. Jamison, B.P. Linder, M. Copel, V.K. Paruchuri, V.S. Basker, R. Haight, D. Lim, R. Carruthers, T. Shaw, M. Steen, J. Sleight, J. Rubino, H. Deligianni, S. Guha, R. Jammy, and G. Shahidi: Symp. VLSI Technol., 2005, 230.
[58] J.K. Schae®er, L.R.C. Fonseca, S.B. Samavedam, Y. Liang, P.J. Tobin and B.E. White: Appl. Phys. Lett., 2004, 85, 1826.
[59] Y.C. Cheng and E.A. Sullivan: J. Appl. Phys., 1973, 44, 923.
[60] S. Krupanidhi, N. Ma®eo, M. Sayer and K.E. Asse: J. Appl. Phys., 1983, 54, 6601.
[61] K. Sreevinas, M. Sayer, D.J. Baar and M. Nishioka: Appl. Phys. Lett., 1988, 52, 709.
[62] K. Saenger, R. Roy, K. Etzold and J. Cuomo: Mater. Res. Soc. Symp. Proc., 1991, 200, 115.
[63] R. Ramesh, A. Inam, W.K. Chan, F. Tillerot, B. Wilkens, C.C. Chang, T. Sands, J.M. Tarascon and V.G. Keramidas: Appl. Phys. Lett., 1991, 59, 3542.
[64] K.D. Budd, S.K. Dey and D.A. Payne: Br. Ceram. Soc. Proc., 1985, 36, 107.
[65] T. Kawahara, M. Yamamuka, T. Makita, J. Naka, A. Yuuki, N. Mikami and K. Ono: Jpn. J. Appl. Phys., 1994, 33, 5129.
[66] L.A. Wills, W.A. Feil, B.W. Wessels, L.M. Tonge and T.J. Marks: J. Cryst. Growth, 1991, 107, 712.
[67] M. de Keijser, G.J.M. Dormans, J.F.M. Gillessen, D.M. de Leeuw and H.W. Zandbergen: Appl. Phys. Lett., 1991, 58, 2636.
[68] M. de Keijser and G.J.M. Dormans: Mater. Res. Soc. Bull., 1996, 21, 37.
[69] A. Jones: Chem. Vap. Deposition, 1998, 4, 169.
[70] I.M. Watson: Chem. Vap. Deposition, 1997, 3, 9.
[71] A.C. Jones: J. Mater. Chem., 2002, 12, 2576.
[72] O. Sneh, R.B. Clark-Phelps, A.R. Londergan, J. Winkler and T.E. Seidel: Thin Solid Films, 2002, 402, 248.
[73] M. Leskela and M. Ritala: Thin Solid Films, 2002, 409, 138.
[74] R.L. Puurunen: J. Appl. Phys., 2005, 97, 121301.
[75] A.C. Jones, H.C. Aspinall, P.R. Chalker, R.J. Potter, K. Kukli, A. Rahtu, M. Ritalac and M. Leskela: J. Mater. Chem., 2004, 14, 3101.
[76] A.C. Jones, H.C. Aspinall, P.R. Chalker, R.J. Potter, T.D. Manning, Y.F. Loo, R.O. Kane, J.M. Gaskell and L.M. Smith: Chem. Vap. Deposition, 2006, 12, 83.
[77] M. Schumacher, P.K. Baumann and T. Seidel: Chem. Vap. Deposition, 2006, 12, 99.
[78] W. Tsai, R.J. Carter, H. Nohira, M. Caymax, T. Conard, V. Cosnier, S. DeGendt, M. Heyns, J. Petry, O. Richard, W. Vandervorst, E. Young, C. Zhao, J.
Maes, M. Tuominen, W.H. Schulte, E. Garfunkel and T. Gustafsson: Microelectron. Eng., 2003, 65, 259.
[79] D.R.G. Mitchell, A. Aidla and J. Aarik: Appl. Surf. Sci., 2006, 253, 606.
[80] J. Lu, J. Aarik, J. Undqvist, K. Kukli, A. Harsta and J.O. Carlsson: J. Cryst. Growth, 2005, 273, 510.
[81] A.J. Craven, M. MacKenzie, D.W. McComb and F.T. Docherty: Microelectron. Eng., 2005, 80, 90.
[82] M. MacKenzie, A.J. Craven, D.A. Hamilton and D.W. McComb: Appl. Phys. Lett., 2006, 88, 022108.
[83] K. Sekine, S. Inumiya, M. Sato, A. Kaneko, K. Eguchi and Y. Tsunashima: IEDM Tech. Digest, 2003, 102.
[84] Y.H. Lin, C.H. Chien, C.T. Lin, C.W. Chen, C.Y. Chang and T.F. Lei: IEDM Tech. Digest, 2004, 1080.
[85] M.A. Quevedo-Lopez, M.R. Visokay, J.J. Chambers, M.J. Bevan, A. LiFatou, L. Colombo, M.J. Kim, B.E. Gnade and R.M. Wallace: J. Appl. Phys., 2005, 97, 043508.
[86] T.M. Pan, C.L. Chen, W.W. Yeh and W.J. Lai: Electrochem. Solid-State Lett., 2007, 10, H101.
[87] M. Leskala and M. Ritala: J. Solid State Chem., 2003, 171, 170.
[88] T.M. Pan, J.D. Lee and W.W. Yeh: J. Appl. Phys., 2007, 101, 024110.
[89] S. Duenas, H. Castan, H. Garcia, A. Gomez, L. Bailon, K. Kukli, T. Hatanpaa, J. Lu, M. Ritala and M. Leskela: J. Electrochem. Soc., 2007, 154, G207.
[90] G.D. Wilk, R.M. Wallace and J.M. Anthony: J. Appl. Phys., 2001, 89, 5243.
[91] J.A. Gupta, D. Landheer, J.P. McCa®rey and G.I. Sproule: Appl. Phys. Lett., 2001, 78, 1718.
[92] M. Copel, E. Cartier and F.M. Ross: Appl. Phys. Lett., 2001, 78, 1607.
[93] J. Kwo, M. Hong, A.R. Kortan, K.T. Queeney, Y.J. Cabal, J.P. Mannaerts, T. Boone, J.J. Krajewski, A.M. Sergent and J.M. Rosamilia: Appl. Phys. Lett., 2000, 77, 130.
[94] J.A. Gupta, D. Landheer, J.P. McCa®rey and G.F.I. Sproule: Appl. Phys. Lett., 2001, 78, 1718.
[95] M.D. Kannan, S.K. Narayandass, C. Balasubramanian and D. Mangalaraj: Phys. Stat. Sol. (a), 1991, 128, 427.
[96] A.C. Jones, H.C. Aspinall, P.R. Chalker, R.J. Potter, K. Kukli, A. Rahtu, M. Ritala and M. Leskela: Mater. Sci. Eng. B, 2005, 118, 97.
[97] J. PÄaivÄasaari, J. NiinistÄo, P. MyllymÄaki, C.L. Dezelah, C.H. Winter, M. Putkonen, M. Nieminen and L. NiinistÄo: Top. Appl. Phys., 2006, 106, 15.
[98] M. LeskelÄa, K. Kukli and M. Ritala: J. All. Compd., 2006, 418, 27
[99] J. Kwo: J. Appl. Phys., 2001, 89, 3920.
[100] B.W. Busch, J. Kwo, M. Hong, J.P. Mannaerts, B.J. Sapjeta, W.H. Schulte, E. Garfunkel and T. Gustafsson: Appl. Phys. Lett., 2001, 79, 2447.
[101] S. Stemmer, J.P. Maria and A.I. Kingon: Appl. Phys. Lett., 2001, 79, 102.
[102] H.J. Osten, J.P. Liu, P. Gaworzewski, E. Bugiel and P. Zaumseil: IEDM Tech. Digest., 2000, 653.
[103] G. Adachi and N. Imanaka: Chem. Rev., 1998, 98, 1479.
[104] L.R. Morss: Chem. Rev., 1976, 7, 827.
[105] H.J. Osten, J.P. Liu and H.J. Mussig: Appl. Phys. Lett., 2002, 80, 297.
[106] R.L. Nigro, G. Malandrino, R.G. Toro and I.L. Fragala: Chem. Vap. Deposition, 2006, 12, 109.
[107] T. Heeg, M. Wagner, J. Schubert, C. Buchal, M. Boese, M. Luysberg, E. Cicerrella and J.L. Freeouf: Microelectron. Eng., 2005, 80, 150.
[108] C. Zhao, T. Witters, B. Brijs, H. Bender, O. Richard, M. Caymax, T. Heeg, J. Schubert, V.V. Afanas'ev, A. Stesmans and D.G. Schlom: Appl. Phys. Lett., 2005, 86, 132903.
[109] H.J. Osten, M. Czernohorsky, R. Dargis, A. Laha, D. KÄUhne, E. Bugiel and A. Fissel: Microelectron. Eng., 2007, 84, 2222.
[110] H.J. Osten, D. KÄuhne, A. Laha, M. Czernohorsky, E. Bugiel and A. Fissel: J. Vac. Sci. Technol. B, 2007, 25, 1039.
[111] A. Laha, A. Fissel, E. Bugiel and H.J. Osten: Thin Solid Films, 2005, 515, 6512.
[112] D.G. Schlom and J.H. Haeni: MRS Bull., 2002, 27, 198.
[113] C. Marchiori, M. Sousa, A. Guiller, H. Siegwart, J.P. Locquet, J. Fompeyrine, G.J. Norga and J.W. Seo: Appl. Phys. Lett., 2006, 88, 72913.
[114] G.J. Norga, C. Marchiori, C. Rossel, A. Guiller, J.P. Locquet, H. Siegwart, D. Caimi and J. Fompeyrine, J.W. Seo and C. Dieker: J. Appl. Phys., 2006, 99, 84102.
[115] C.J. Forst, C.R. Ashman, K. Schwarz and P.E. Bloch: Nature, 2004, 427, 53.
[116] S.A. Chambers, Y. Liang, Z. Yu, R. Droopad, J. Ramdani and K. Eisenbeiser: Appl. Phys. Lett., 2000, 77, 1662.
[117] R. Schwab, R. Sporl, P. Severloh, R. Heidinger and J. Halbritter: Inst. Phys. Conf. Ser., 1997, 158, 61.
[118] S.G. Lim, S. Kriventsov, T.N. Jackson, J.H. Haeni, D.G. Schlom, A.M. Balbashov, R. Uecker, P. Reiche, J.L. Freeouf and G. Lucovsky: J. Appl. Phys., 2003, 91, 4500.
[119] L.F. Edge, D.G. Schlom, S.A. Chambers, E. Cicerrella, J.L. Freeouf, B. Hollander and J. Chubert: Appl. Phys. Lett., 2004, 84, 726.
[120] A.D. Li, Q.Y. Shao, H.Q. Ling, J.B. Cheng, D. Wu, Z.G. Liu and N.B. Ming: Appl. Phys. Lett., 2003, 17, 3540.
[121] P. Ellissier, R. Baptist and G. Chauvet: Surf. Sci., 1989, 210, 99.
[122] D.O. Klenov, D.G. Schlom, H. Li and S. Stemmer: Jpn. J. Appl. Phys., 2005, 44, L617.
[123] M.V. Fischetti, D.A. Neumayer and E.A. Cartier: J. Appl. Phys., 2001, 90, 4587.
[124] S. Datta, G. Dewey, M. Doczy, B.S. Doyle, B. Jin, J. Kavalieros, R. Kotlyar, M. Metz, N. Zelick and R. Chau: IEDM Tech. Digest, 2003, 653.
[125] E.P. Gusev, D.A. Buchanan, E. Cartier, A. Kumar, D. DiMaria, S. Guha, A. Callegari, S. Zafar, P.C. Jamison, D. Neumayer, M. Copel, M.A. Gribelyuk, H. Okorn-Schmidt, C.D. Emic, P. Kozlowski, K. Chan, N. Bojarczuk, L. Ragnarsson, P. Ronshein, K. Rim, R.J. Fleming, A. Mocuta and A. Ajmera: IEDM Tech. Di-gest, 2001, 451.
[126] R. Chau, S. Datta, M. Doczy, B. Doyle, J. Kavalieros and M. Metz: IEEE Elect. Dev. Lett., 2004, 25, 408.
[127] S.P. Murarka: J. Vac. Sci. Technol., 1980, 17, 775.
[128] S.P. Murarka, D.B. Fraser, A. Sinha and H.J. Levinstein: IEEE Trans. Electron Devices, 1980, 27, 1409.
[129] S. Inoue, N. Toyokura, T. Nakamura and H. Ishikawa: J. Electrochem. Soc., 1981, 128, 2402.
[130] B. Tavel, T. Skotnicki, G. Pares, N. Carriere, M. Rivoire, F. Leverd, C. Julien, J. Torres and R. Pantel: IEDM Tech. Digest, 2001, 825.
[131] Z. Krivokapic, W.P. Maszara, K. Achutan, P. King, J. Gray, M. Sidorow, E. Zhao, J. Zhang, J. Chan, A. Marathe and M.R. Lin: IEDM Tech. Digest, 2002, 271.
[132] J. Kedzierski, D. Boyd, P. Ronsheim, S. Zafar, J. New-bury, J.O.C. Cabral, M. Ieong and W. Haensch: IEDM Tech. Digest, 2003, 315.
[133] K. Takahashi, K. Manabe, T. Ikarashi, N. Ikarashi, T. Hase, T. Yoshihara, H. Watanabe, T. Tatsumi and Y. Mochizuki: IEDM Tech. Digest, 2004, 91.
[134] C.Y. Kang, P. Lysaght, R. Choi, B.H. Lee, S.J. Rhee, C.H. Choi, M.S. Akbar and J.C. Lee: Appl. Phys. Lett., 2005, 86, 222906.
[135] J.K. Schae®er, L.R.C. Fonseca, S.B. Samavedam, Y. Liang, P.J. Tobin and B.E. White: Appl. Phys. Lett., 2004, 85, 1826.
[136] J.K. Schae®er, S.B. Samavedam, D.C. Gilmer, V. Dhandapani, P.J. Tobin, J. Mogab, B.Y. Nguyen, B.E. White, S.D.Murthy, R.S. Rai, Z.X. Jiang, R. Martin,
M.V. Raymond, M. Zavala, L.B. La, J.A. Smith, R. Garcia, D. Roan, M. Kottke and R.B. Gregory: J. Vac. Sci. Technol. B, 2003, 21, 11.
[137] P.S. Lysaght, J.J. Peterson, B. Foran, C.D. Young, G. Bersuker and H.R. Hu®: Mater. Sci. Semicond. Process., 2004, 7, 259.
[138] M.P. Agustin, L.R.C. Fonseca, J.C. Hooker and S. Stemmer: Appl. Phys. Lett., 2005, 87, 121909.
[139] M.P. Agustin, H. Alshareef, M.A.Q. Lopez and S. Stemmer: Appl. Phys. Lett., 2006, 89, 041906.
[140] J.H. Harris, R.A. Youngman and R.G. Teller: J. Mater. Res., 1990, 5, 1763.
[141] R.A. Youngman and J.H. Harris: J. Am. Ceram. Soc., 1990, 73, 3238.
[142] S. Stemmer: J. Vac. Sci. Technol. B, 2004, 22, 791.
[143] C.M. Perkins, B.B. Triplett, P.C. McIntyre, K.C. Saraswat and E. Shero: Appl. Phys. Lett., 2002, 81, 1417.
[144] H.N. Alshareef, H.F. Luan, K. Choi, H.R. Harris, H.C. Wen, M.A. Quevedo-Lopez, P. Majhi and B.H. Lee: Appl. Phys. Lett., 2006, 88, 112114.
[145] F.T. Docherty, M. MacKenzie, D. Pennicard1, A.J. Craven and D.W. McComb: J. Phys.: Conference Ser., 2006, 26, 231.

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